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First bonding component and bonding device

A component and bonding technology, which is applied in the field of the first bonding component and bonding device, can solve problems such as low bonding efficiency

Active Publication Date: 2018-12-21
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a first bonding element and a bonding device for the problem of low bonding efficiency

Method used

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  • First bonding component and bonding device
  • First bonding component and bonding device
  • First bonding component and bonding device

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Embodiment Construction

[0027] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0028] Details figure 1 , a bonding device 50 provided by an embodiment of the present invention, the bonding device 50 includes a first bonding element 10, a second bonding element 20 and an annular rubber ring 30, the annular rubber ring 30 is arranged on the first bonding Between ...

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Abstract

The invention relates to a first bonding component and a bonding device. The first bonding component is configured to be thermally bonded to a second bonding component through an annular rubber ring to form a closed space between the first bonding component and the second bonding component, and the first bonding component comprises the following parts: a bonding body, which is provided with a through hole, wherein the through hole runs through the bonding body in a direction from the first bonding component to the second bonding component, so that both ends of the through hole are respectivelycommunicated with the closed space and the outside; and a pressure releasing mechanism capable of movably closing the through hole, wherein when the air pressure in the closed space is greater than the external air pressure, the closed space communicates with the outside through the through hole to achieve pressure releasing, and when the air pressure in the closed space is less than or equal tothe external air pressure, the pressure releasing mechanism closes the through hole. In the above-mentioned first bonding component and bonding device, when the first bonding component and the secondbonding component are thermally bonded through the annular rubber ring, the air pressure in the closed space can be adjusted by the pressure releasing mechanism to prevent the air in the closed spacefrom being thermally expanded, resulting in deformation of the uncured annular rubber ring.

Description

technical field [0001] The invention relates to the field of product assembly, in particular to a first bonding element and a bonding device. Background technique [0002] In the field of product assembly, it is usually necessary to use dispensing to make the two components stick together. After the glue is cured, the fixed connection of the two components is realized. The specific process is as follows: First, glue is dispensed on one component to form an annular rubber ring; then another component is attached to the annular rubber ring; then the two components and the annular rubber ring sandwiched between the two components are heated; After the rubber ring has cured, the two components are firmly connected together. Since the annular rubber ring is closed and has a certain thickness, after another component is pasted on the annular rubber ring, a closed space with air will be formed between the two components, and during the heating process, the air in the closed space ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13G09F9/30
CPCG02F1/1303G09F9/30
Inventor 涂晋益
Owner INTERFACE TECH CHENGDU CO LTD
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