Full-automatic double-track glue dispensing machine and glue dispensing process thereof

Abstract

The invention discloses a full-automatic double-track glue dispensing machine and a glue dispensing process thereof. The full-automatic double-track glue dispensing machine comprises a material box feeding mechanism, two conveying tracks, a glue dispensing platform and a glue dispensing assembly. The two conveying tracks are arranged in parallel in the straight line direction in a spaced mode. Thematerial box feeding mechanism is arranged at the ends of the two conveying tracks in the direction perpendicular to the conveying tracks. A material box assembly is arranged on the side portion of the front end of a transfer member. At least two material boxes are placed in the material box assembly. The glue dispensing platform is arranged in the conveying tracks. The glue dispensing assembly is arranged above the glue dispensing platform. Independent conveying of carrier boards is achieved, and the functions of clamping the boxes, distributing materials to the conveying tracks, pushing thecarrier boards to the conveying tracks and the like are simultaneously completed; frictional collision between the adjacent carrier boards is effectively avoided; and through a linear pushing mode, the positional stability of fingerprint modules on the carrier boards is ensured while the feeding and discharging efficiency is improved.

Description

technical field [0001] The invention relates to the field of mechanical automation, in particular to a fully automatic double-track glue dispensing machine and a glue dispensing process thereof. Background technique [0002] In recent years, smart phone technology has developed rapidly, and various new technologies have been continuously applied in the manufacturing process of smart phones, such as the fingerprint recognition boot technology that appears in domestic mobile phones. The hardware and software foundation of fingerprint recognition technology is fingerprint modules. In the process of mobile phone production and assembly, the bottom of the FPC+IC product for the fingerprint module needs to be filled with glue, so that the FPC+IC of the fingerprint module can be fixed on the carrier board; in the process of solving the problem of fingerprint module dispensing automation and productivity improvement Among them, there are the following key technical problems that nee...

AI Technical Summary

Problems solved by technology

[0002] In recent years, smart phone technology has developed rapidly, and various new technologies have been continuously applied in the manufacturing process of smart phones, such as the fingerprint recognition boot technology that appears in domestic mobile phones. The hardware and software foundation of fingerprint recognition technology is fingerprint modules. In the process of mobile phone production and assembly, the bottom of the FPC+IC product for the fingerprint module needs to be filled with glue, so that the FPC+IC of the fingerprint module can be fixed on the carrier board; in the process of solving the problem of fingerprint module dispensing automation and productivity improvement Among them, there are the following key technical problems that need to be solved: 1. Since modern industrial production mostly adopts the automatic production line mode, this production mode can complete the processing of various processes for the continuous flow of concentrated and large-scale products, while the existing loading method of the carrier board Generally, a manipulator is used to move the carrier board out or put it into the material box. In this loading method, the carrier board is directly stacked in the material box, and the adjacent carrier boards will wear and collide with each other during storage and transportation, resulting in Or the fingerprint module is damaged, especiall...

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