Variable magnetic field cathode device of magnetron sputtering equipment
A magnetron sputtering, variable technology, applied in sputtering coating, ion implantation coating, metal material coating process, etc., can solve the problem of high magnetic field intensity in the center of the target surface and uniform radial magnetic field distribution on the target surface problems such as poor performance and low target utilization, achieving the effect of complete experimental data, high precision and continuous adjustment
Pending Publication Date: 2019-08-09
SOUTHWEST JIAOTONG UNIV
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Problems solved by technology
In short, the radial magnetic field distribution curve on the target surface is a steep three-peak curve with one large and two small, resulting in poor uniformity of radial magnetic field distribution on the target surface.
The magnetic field strength at the center of the target surface is too high, the center of the target is etched and penetrated quickly, the target is replaced quickly, and the utilization rate of the target is low; the cost of magnetron sputtering coating is increased
Method used
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[0021] figure 1 It is shown that a specific embodiment of the present invention is a variable magnetic field cathode device of a magnetron sputtering device, which includes a disc-shaped copper back plate 3, and the target material 1 is fixed on a circular copper back plate 3 through a target holder 9. In the groove on the front of the back plate 3, the back edge of the copper back plate 3 fits with the cover edge of the cylindrical stainless steel cover 5, and the outer peripheral surface of the stainless steel cover 5 is screwed to the inner side wall of the circular target cover 2, The target cover 2 is overcoated on the target holder 9; the inner cavity of the stainless steel cover 5 is provided with a stainless steel water cooler 6 and the water cooler 6 is fixed on the back of the copper back plate 3; it is characterized in that:
[0022] The back of the water cooler 6 is divided into three regions from the center to the edge, the center, the middle and the outside. The ...
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The invention discloses a variable magnetic field cathode device of magnetron sputtering equipment. The back surface of a water cooler of the device is sequentially divided into a core part, a middlepart and an outer part from the center to the edge, and a circular-ring-shaped protrusion is arranged in the middle of the back surface of the water cooler; a cake-type main coil with the radius equalto the radius of a copper back plate is arranged in a gap between the protrusion and the front surface of a stainless steel cover; and a cake-type core coil is arranged between the part, in the protrusion, of the back part of the water cooler and the main coil, and a cake-type outer coil is arranged between the part, outside the protrusion, of the back part of the water cooler and the main coil.According to the device, stepless adjustment of the magnetic field intensity of the target surface can be realized, the intensity distribution of the radial magnetic field of the target surface is uniform, and the utilization rate of a target material is high; and a parameter optimization experiment for magnetron sputtering coating by utilizing the device is high in efficiency and low in cost, obtained experimental data is more complete and more accurate, and high in precision.
Description
technical field [0001] The invention relates to components of magnetron sputtering coating equipment, in particular to a cathode device of the magnetron sputtering coating equipment. Background technique [0002] Magnetron sputtering is the main technology for preparing thin films in current industrial production. It is widely used in electronics and information industries, such as liquid crystal storage, liquid crystal display, integrated circuits, electronic control devices, etc. It can also be used in the field of glass coating, and can also be used in Wear-resistant materials, corrosion-resistant materials, high-end decorative products and other industries. [0003] Before mass production of thin film products in various industries, it is always necessary to debug various sputtering parameters to obtain optimal process conditions. These parameters mainly include sputtering power, substrate temperature, sputtering pressure and magnetic field strength. Among them, the sp...
Claims
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IPC IPC(8): C23C14/35
CPCC23C14/35C23C14/3407
Inventor雷鸣李腾腾陈炜羊新胜陈勇赵勇
OwnerSOUTHWEST JIAOTONG UNIV