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Fingerprint sensing device and electronic device

A sensor device and fingerprint technology, which is applied in the acquisition/organization of fingerprints/palmprints, circuits, electrical components, etc., can solve problems such as performance degradation of fingerprint sensor devices, damage to semiconductor components, and functional failures, and improve electrostatic protection capabilities. , the effect of reducing parasitic capacitance and reducing the area

Pending Publication Date: 2019-08-23
CHIPONE TECH BEIJINGCO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The voltage difference between the two ends of the above-mentioned electric field increases with the increase of ESD energy. When the voltage difference is greater than the gate breakdown voltage of the semiconductor element, it will cause damage or damage to the semiconductor element, resulting in reduced performance or functional failure of the fingerprint sensor device.

Method used

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  • Fingerprint sensing device and electronic device
  • Fingerprint sensing device and electronic device
  • Fingerprint sensing device and electronic device

Examples

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Embodiment Construction

[0045] Various embodiments of the invention will be described in more detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same or similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale.

[0046] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0047] Figure 4 A schematic diagram of a fourth unit according to the prior art is shown. Such as Figure 4 As shown, the fourth unit 170 of the prior art includes a first diode D1 and a second diode D2 . The fourth unit 170 is used to discharge static electricity and provide conduction paths for normal induction signals and operating currents in the circuit. Preferably, a voltage adjustment module 171 is further included between the first diode D1 and the second diode D2, and the first end of...

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PUM

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Abstract

The invention discloses a fingerprint sensing device. The fingerprint sensing device includes a first unit including multiple switch tubes, multiple second units which are arranged on the first unit and are used for providing induction signals, multiple third units used for providing detection signals according to the induction signals, and multiple fourth units which are connected between the corresponding second units and the corresponding third units and are used for providing release paths of static charges and conduction paths of the induction signals, wherein each fourth unit includes atleast one static protection element, and a parasitic diode of at least one of the multiple switch tubes provides at least one of the static protection elements. The fingerprint sensing device is advantaged in that the parasitic diodes of the switch tubes are utilized to form at least one of the static protection elements, the occupation land of a circuit is reduced, the multiple fourth units canbe corresponding connected with the multiple second units, and static protection capability is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, and more specifically, to a fingerprint sensing device and electronic equipment. Background technique [0002] The prior art fingerprint sensing device has a plurality of second units. When a user places a finger on the surface of the fingerprint sensing device, the variation of the capacitance of the second units is used to determine the pattern of the fingerprint. [0003] figure 1 A schematic diagram of a fingerprint sensing device according to the prior art is shown. Such as figure 1 As shown, the fingerprint sensing device 100 includes a first unit 110 , a second unit 120 located on the first unit 110 , and a protective layer 130 covering the second unit 120 . A third unit 140 connected to the second unit 120 is formed on the first unit 110, and the second unit 120 includes a plurality of second units 120 arranged in a matrix. When the finger 150 touches or approaches the pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/02G06K9/00
CPCH01L27/0255G06V40/1306
Inventor 赵帆李卓陈飞祥
Owner CHIPONE TECH BEIJINGCO LTD
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