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Electronic device, its tray and manufacturing method for the tray

A Cato, Cato Cap technology, applied in branch equipment, circuits, electrical components, etc., can solve the problems of complex process and long processing time, and achieve the effect of simple process, convenient assembly process, and reduced processing time.

Active Publication Date: 2021-01-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing manufacturing process of the Cato, the Cato cap is processed as a semi-finished product, and then injection-molded with the Cato body, and then repeatedly milled and polished. The process is relatively complicated and the processing time is relatively long.

Method used

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  • Electronic device, its tray and manufacturing method for the tray
  • Electronic device, its tray and manufacturing method for the tray
  • Electronic device, its tray and manufacturing method for the tray

Examples

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0026] The tray assembly in the traditional electronic equipment generally includes the tray main body and the tray cap arranged at the outer end of the tray main body. out. However, in the existing manufacturing process of the cap, the semi-finished product of the cap is process...

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PUM

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Abstract

The invention provides a card support. The card support comprises a card support main body and a card support cap, wherein the card support cap comprises a cap cover and a connection body, wherein theconnection body is arranged at one side of the cap cover and comprises a side surface, the side surface is connected to the cap cover, and an installation groove is formed in the connection body andpenetrates through the side surface to form an assembly hole in the side surface so that the card support main body is allowed to be inserted into the installation groove from the assembly hole. In the card support provided by the invention, the installation groove of the connection body penetrates through the side surface to form the assembly hole, the card support main body is inserted into theinstallation groove from the assembly hole, connection of the card support main body and the card support cap is further achieved, and the assembly process is relatively convenient; and since the installation groove of the connection body penetrates through the side surface to form the assembly hole, the process of forming the assembly hole and the installation groove in the connection body is relatively simple, and the processing time of the card support is further reduced. The invention also provides a manufacturing method of the card support and electronic equipment employing the card support.

Description

technical field [0001] The present application relates to the field of consumer electronic equipment, and in particular to an electronic equipment, its tray and a method for manufacturing the tray. Background technique [0002] With the development of existing electronic device technology, more and more electronic devices have entered people's daily life. As the performance of electronic devices such as mobile phones and tablets is getting higher and higher, their functions are getting stronger and stronger. Wherein, the tray assembly in the electronic equipment generally includes the tray main body and the tray cap arranged at the outer end of the tray main body. out. However, in the existing manufacturing process of the cap, the semi-finished product of the cap is processed first, and then injection-molded with the body of the cap, followed by repeated milling and grinding. The process is relatively complicated and the processing time is long. Contents of the invention...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R12/71H01R13/502H01R13/504H01R13/629H01R43/20H04M1/02
CPCH01R12/714H01R13/502H01R13/504H01R13/629H01R43/20H01R2201/16H04M1/0274
Inventor 张业帆
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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