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Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same

一种树脂组合物、预浸渍片的技术，应用在制造印刷电路前体、印刷电路、印刷电路等方向，能够解决介电性质不佳、介电耗损因子高等问题

Active Publication Date: 2019-12-20
TAIWAN POWDER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] It has been found that, compared with the electronic material prepared by using the resin composition containing the BPA-BZ hardener, the electronic material prepared by using the resin composition containing the ODA type BZ hardener has a lower glass transition temperature (glass transition temperature, Tg ) can be improved, but the electronic material still has the problem of poor dielectric properties (Dk and Df), especially when it is applied to high-frequency electronic products, it is easy to cause the problem of excessive dielectric dissipation factor (Df)

Method used

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  • Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
  • Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
  • Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same

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Embodiment Construction

[0029] The following will specifically describe some specific implementations according to the present invention; however, without departing from the spirit of the present invention, the present invention can also be practiced in a variety of different forms, and the protection scope of the present invention should not be limited to the specific implementations. plan.

[0030] As used in this specification (and especially in the claims), "a," "the," and similar terms should be understood to include both the singular and the plural unless the context clearly dictates otherwise.

[0031] Unless otherwise stated in the text, when describing the components contained in the solution, mixture or composition in this specification, the calculation is based on the dry weight, that is, the weight without including the solvent.

[0032]The effect of the present invention compared with the prior art is that the resin composition of the present invention uses a benzoxazine resin with a spe...

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Abstract

The invention provides a resin composition, which comprises following components: (A) epoxy resin; (B) a compound represented by a formula (I), wherein in the formula (I), R1 and R2 individually represent -H, -CH3, or -C(CH3)3; and (C) an optional filling material.

Description

technical field [0001] The present invention relates to a kind of resin composition, especially relates to a kind of epoxy resin resin composition that can provide the electronic material with following advantages: low dielectric constant (dielectric constant, Dk), low dielectric dissipation factor (dissipation factor) , Df), low water absorption, good heat resistance and good finished product appearance. The resin composition of the present invention can form a composite material or a prepreg sheet with glass fibers, or can be further used as an adhesive agent for metal foil to make laminates, printed circuit boards and integrated circuit (integrated circuit, IC) carrier boards. Background technique [0002] As the requirements for data transmission in the field of electronic communication technology continue to increase, the application of electronic products continues to develop in higher frequency areas, and the requirements for the dielectric properties (Dk and Df) of r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/04C08L35/06C08K13/06C08K3/36C08K5/3415C08K5/5313C08K5/5399B32B15/092B32B27/04C08J5/24H05K1/03
CPCC08L63/04B32B15/092H05K1/036C08L2201/08C08J2363/04C08J2435/06B32B2457/08C08J5/244C08L35/06C08K13/06C08K3/36C08K5/3415C08K5/5313C08K5/5399C08J2363/00H05K2201/012H05K1/0373H05K1/0346H05K1/0326H05K2201/0209H05K2201/026H05K2201/0326H05K2201/0257H05K3/022H05K2201/0323C08K5/357C08L63/00G01N17/006H05K1/024H05K2203/0776H05K2203/162H05K2203/1105C08J5/24
Inventor 廖志伟曾冠勋林宗贤黄竹鸣
Owner TAIWAN POWDER TECH CO LTD
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