Method for processing V-type groove of ultra-thick metal substrate printed board

A metal substrate and processing method technology, applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of inability to process, shortened life, and short life, and achieve the effect of fast and safe production and improved life.
CN110769600APending Publication Date: 2020-02-07HUIZHOU KING BROTHER CIRCUIT TECH +2
5 Cites 2 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUIZHOU KING BROTHER CIRCUIT TECH
Publication Date
2020-02-07

Smart Images

  • Figure 1
    Figure 1
Patent Text Reader

Abstract

The invention provides a method for processing a V-type groove of an ultra-thick metal substrate printed board, and the method comprises the following steps of S1, election of a V-CUT machine and a V-CUT knife; S2, design of V-CUT processing data; S3, setting of V-CUT processing parameters; and S4, inspection of the processing dimension of the V-type groove of ultra-thick metal substrate products.The invention starts from the technical capability of the equipment and the material technical capability of the tool, and designs V-CUT processing of the special ultra-thick metal-based printing circuit board through the technical capability of the V-CUT machine equipment and the deeper technical development of the V-CUT knife material and angle, thereby ensuring that ultra-thick and high-hardness metal substrate microwave products can be produced in batches, quickly and safely, improving product quality, and solving the technical problem that conventional V-CUT machines and V-CUT knives cannot produce ultra-thick metal substrates.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the technical field of PCB processing, and in particular relates to a processing method for a V-shaped groove of an ultra-thick metal substrate printed board. Background technique

[0002] Metal-based printed boards replace FR4 and brittle ceramic substrates in the field of high-frequency microwave communication composed of long-distance communication, navigation, medical treatment, transportation, transportation, storage power modules, intelligent optoelectronics, and digital systems, with good heat dissipation performance and more stable dimensions, so that The problem of thermal expansion and cold contraction of different materials of components on the printed board is alleviated, and the durability and reliability of the whole machine and electronic equipment are improved. However, the thickness of the metal base is between 1.0-3.2mm, and the thickness of some PCB boards is between 3.2-5.0mm. For products with process edg...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More