Method for processing V-type groove of ultra-thick metal substrate printed board

A metal substrate and processing method technology, applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of inability to process, shortened life, and short life, and achieve the effect of fast and safe production and improved life.

Pending Publication Date: 2020-02-07
HUIZHOU KING BROTHER CIRCUIT TECH +2
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing technology and equipment can only produce conventional products with a plate thickness below 3.2mm, but cannot produce products with a thickness exceeding the above or metal substrates
There is a patented method of using a 150V-CUT knife to increase the speed of processing, but the 150 V-CUT knife is a tungsten steel product, and the tooth density material is soft. It can only produce conventional FR4 PCB products with a thickness of less than 3.2mm, and its life is short.
For PCB products with high hardness or metal materials, 150 tungsten steel V-CUT cutters are used to produce the cutters, and the tool life will be shortened by more than 90%. For ultra-thick metal-based products with a thickness of 3.2-5.0mm, the V-CUT machine can not be processed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for processing V-type groove of ultra-thick metal substrate printed board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A method for processing a V-groove of an ultra-thick metal substrate printed board, characterized in that it comprises the following steps:

[0029] S1. Selection of V-CUT machine and V-CUT knife: Choose a PIN nail V-CUT machine with the function of controlling the depth of V-cut, and choose a V-CUT tool with the same degree according to the V-CUT angle required for processing;

[0030] S2. Design of V-CUT processing data: According to the equipment parameters of the V-CUT machine, set the hanging hole according to the hole center distance of 100mm, and calculate the center line of the V-CUT knife passing through according to the outer frame data and degree data processed as required, and make the data;

[0031] S3. V-CUT processing parameter setting: processing times: design the V-CUT times according to the thickness of the PCB and the excess thickness to be processed, where, the V-CUT times (integer) = ((board thickness - excess thickness) ÷ processing depth / knife) ...

Embodiment 2

[0039] A method for processing a V-groove of an ultra-thick metal substrate printed board, characterized in that it comprises the following steps:

[0040] S1. Selection of V-CUT machine and V-CUT knife: Choose a PIN nail V-CUT machine with the function of controlling the depth of V-cut, and choose a V-CUT tool with the same degree according to the V-CUT angle required for processing;

[0041] S2. Design of V-CUT processing data: According to the equipment parameters of the V-CUT machine, set the hanging hole according to the hole center distance of 80mm, and calculate the center line of the V-CUT knife passing through according to the outer frame data and degree data processed as required, and make the data;

[0042]S3. V-CUT processing parameter setting: processing times: design the V-CUT times according to the thickness of the PCB and the excess thickness to be processed, where, the V-CUT times (integer) = ((board thickness - excess thickness) ÷ processing depth / knife) ÷ ...

Embodiment 3

[0050] A method for processing a V-groove of an ultra-thick metal substrate printed board, characterized in that it comprises the following steps:

[0051] S1. Selection of V-CUT machine and V-CUT knife: Choose a V-CUT machine with a V-CUT machine with the function of controlling the depth of V-cut, and choose a V-CUT tool with the same degree according to the V-CUT angle required for processing;

[0052] S2. Design of V-CUT processing data: According to the equipment parameters of the V-CUT machine, set the hanging hole according to the hole center distance of 120mm, and calculate the center line of the V-CUT knife according to the outer frame data and degree data processed as required and make the data;

[0053] S3. V-CUT processing parameter setting: processing times: design the V-CUT times according to the thickness of the PCB and the excess thickness to be processed, where, the V-CUT times (integer) = ((board thickness - excess thickness) ÷ processing depth / knife) ÷ 2 s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a method for processing a V-type groove of an ultra-thick metal substrate printed board, and the method comprises the following steps of S1, election of a V-CUT machine and a V-CUT knife; S2, design of V-CUT processing data; S3, setting of V-CUT processing parameters; and S4, inspection of the processing dimension of the V-type groove of ultra-thick metal substrate products.The invention starts from the technical capability of the equipment and the material technical capability of the tool, and designs V-CUT processing of the special ultra-thick metal-based printing circuit board through the technical capability of the V-CUT machine equipment and the deeper technical development of the V-CUT knife material and angle, thereby ensuring that ultra-thick and high-hardness metal substrate microwave products can be produced in batches, quickly and safely, improving product quality, and solving the technical problem that conventional V-CUT machines and V-CUT knives cannot produce ultra-thick metal substrates.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a processing method for a V-shaped groove of an ultra-thick metal substrate printed board. Background technique [0002] Metal-based printed boards replace FR4 and brittle ceramic substrates in the field of high-frequency microwave communication composed of long-distance communication, navigation, medical treatment, transportation, transportation, storage power modules, intelligent optoelectronics, and digital systems, with good heat dissipation performance and more stable dimensions, so that The problem of thermal expansion and cold contraction of different materials of components on the printed board is alleviated, and the durability and reliability of the whole machine and electronic equipment are improved. However, the thickness of the metal base is between 1.0-3.2mm, and the thickness of some PCB boards is between 3.2-5.0mm. For products with process edg...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044
Inventor 聂兴培李波吴世亮林鹭华乔元
Owner HUIZHOU KING BROTHER CIRCUIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap