Display module and display device

A technology of display module and display area, which is applied in semiconductor/solid-state device parts, instruments, sub-office equipment, etc.

Pending Publication Date: 2020-08-25
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, COP packaging technology still has d

Method used

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  • Display module and display device
  • Display module and display device
  • Display module and display device

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Embodiment Construction

[0022] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary only for explaining the present invention and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, it shall be carried out according to the technique or condition described in the literature in this field or according to the product specification.

[0023] The present invention is based on the following discoveries and recognitions of the inventors:

[0024] Although the COP packaging technology can make the frame very narrow, it also brings problems such as low yield rate, local overheating and causing Panel burning and signal interference. Among them, the local overheating problem is because the driver IC of the COP packaging technology is installed with the front facing up, the back is the panel substrate, and the lower part of the substrate is the SCF (heat dissipation film), so t...

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Abstract

The invention provides a display module and a display device. The display module comprises: a display substrate comprising a display area, a bending area and a binding area; a driving control circuitwhich is arranged on the display substrate and located in the binding area; a main flexible circuit board which is arranged on the display substrate, located in the binding area and located on the inner side of the drive control circuit; a touch flexible circuit board which is arranged on the sides, away from the display substrate, of the driving control circuit and the main flexible circuit boardand falls into the binding area; a heat dissipation metal layer which is arranged between the drive control circuit and the touch flexible circuit board and is in contact with the drive control circuit and the touch flexible circuit board; and a heat dissipation film which is arranged on one side, far away from the driving control circuit, of the display substrate. According to the display module, Panel burn caused by local heat concentration can be avoided, and meanwhile signal interference between the touch flexible circuit board and the Driver IC can be effectively improved and avoided.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a display module and a display device. Background technique [0002] With the development of mobile phone display modules, "full screen" has become a trend, and the borders around the mobile phone are getting narrower and narrower. COP packaging technology has emerged as the times require. This technology is to make the Driver IC (drive control circuit) on the Panel display panel. On the substrate, the Panel can be bent and bonded to the FPC (flexible circuit board) on the back, so the lower frame of the Panel can be made very narrow. However, COP packaging technology still has different defects and needs further improvement. Contents of the invention [0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. Therefore, an object of the present invention is to provide a display module with good hea...

Claims

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Application Information

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IPC IPC(8): G06F3/041G06F1/20H01L23/367H01L23/373H04M1/02
CPCG06F3/0412G06F3/0416G06F1/20H04M1/0266H01L23/367H01L23/3736
Inventor 柴媛媛牛文骁刘练彬陆旭
Owner BOE TECH GRP CO LTD
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