35results about How to "Improve signal interference" patented technology

The invention relates to a relay or repeater node (21) for use in a wireless communications system said node comprising a receive antenna (23) for receiving a signal through a wireless connection, an amplifier (30) for amplifying the signal and a transmit antenna (27) for forwarding the amplified signal, said node further comprising a mode switching unit (31) for switching between at least a first and a second mode of operation of the node in dependence of an amplification gain requirement. This enables optimization of the node for varying conditions in the network.

Techniques are described for wireless communication. One method includes transmitting a sequence of deterministic variations of random access data on at least one interlace of non-contiguous frequency resources allocated to a physical random access channel (PRACH) in an unlicensed spectrum, beginning at a first time; repeating the transmitting of the sequence of deterministic variations of random access data at least once, beginning at a second time; generating at least one modification of the sequence of deterministic variations of random access data, in which the at least one modification is generated according to a modification sequence; and transmitting on the at least one interlace, beginning at a third time, the at least one modification of the sequence of deterministic variations of random access data.

A light sensing apparatus comprises a first base plate, a light emitting diode, a light sensing unit and a driving element electrically connected with the light sensing unit. The invention relates an arraying relation between the light emitting diode and the light sensing unit on the first base plate.

The invention provides a display module and a display device. The display module comprises: a display substrate comprising a display area, a bending area and a binding area; a driving control circuitwhich is arranged on the display substrate and located in the binding area; a main flexible circuit board which is arranged on the display substrate, located in the binding area and located on the inner side of the drive control circuit; a touch flexible circuit board which is arranged on the sides, away from the display substrate, of the driving control circuit and the main flexible circuit boardand falls into the binding area; a heat dissipation metal layer which is arranged between the drive control circuit and the touch flexible circuit board and is in contact with the drive control circuit and the touch flexible circuit board; and a heat dissipation film which is arranged on one side, far away from the driving control circuit, of the display substrate. According to the display module, Panel burn caused by local heat concentration can be avoided, and meanwhile signal interference between the touch flexible circuit board and the Driver IC can be effectively improved and avoided.

The invention discloses a shading film and relates to the field of an FPC (flexible circuit board). The shading film comprises a black PI (polyimide) layer, a black rubber layer and copper foil, wherein the black PI layer, the black rubber layer and the copper foil are sequentially coated with an adhesive for adhesion, and the adhesive is prepared from raw materials in percentage by weight as follows: 10%-15% of rubber, 10%-12% of a flame retardant, 3%-5% of a curing agent, 0.05%-0.1% of an ion catcher, 0.1%-0.5% of an antioxidant, 0.1%-0.5% of an accelerant, 15%-20% of resin, 30%-40% of carbon powder and 6.9%-31.75% of a diluent. The invention further discloses the FPC. The shading film and the FPC have good signal shielding effect and anti-disturbance performance and can block unnecessary light.

The invention relates to a touch control screen, a touch control display screen and a mobile terminal. The conductive pattern layer is arranged on the inner side of the substrate and distributed on the horizontal part and the bent part. The bent part is far away from the side of the conductive pattern layer and separates the conductive pattern layer from the antenna so as to reduce the interference of the conductive pattern layer to the antenna. The invention enlarges the trace space of the lead pattern and improves the signal interference caused by the lead pattern to the antenna. Compared with the prior art which uses insulating glue to isolate the lead pattern and the antenna, the manufacturing process is simpler, and there is no risk of crushing the lead pattern when the antenna is assembled.

The utility model provides a touch panel. The touch panel comprises a substrate, a touch sensing element, a plurality of wires and a grounding electrode. The substrate comprises a displaying area and a peripheral area adjacent to the displaying area. The touch sensing element is arranged on the substrate and at least located in the displaying area. The wires are located on the substrate and in the peripheral area and electrically connected with the touch sensing element. The grounding electrode is arranged on the substrate and in the peripheral area. The grounding electrode comprises a plurality of segments separated from one another.

The invention relates to an elastic piece connecting structure which comprises a first circuit board, an elastic piece and a second circuit board. A containing groove is formed in the upper surface of the first circuit board, the elastic piece comprises a welding end, a contacting end and a bending part, the welding end is arranged at one end of the elastic piece, the welding end is fixed on the upper surface of the first circuit board and connected with the first circuit board in an electrical mode, the contacting end is arranged at the other end of the elastic piece, the bending part is connected with the welding end and the contacting end, and the bending part of the elastic piece is placed in the containing groove. The second circuit board is arranged above the first circuit board in a parallel mode and connected with the contacting end of the elastic piece in the electrical mode, and therefore the second circuit board is connected with the first circuit board through the elastic piece in the electrical mode. According to the elastic piece connecting structure, the elastic piece is arranged in the containing groove which is formed in the upper surface of the first circuit board, the elastic piece is arranged between the first circuit board and the second circuit board, external leaking of radio-frequency signals is reduced notably through shielding of the two circuit boards, and the problem of signal interference between elastic pieces can be improved effectively.

The invention relates to an electric connector comprising an insulating body, a first terminal group, a second terminal group, and a shielding case. The insulating body contains a base part and a tongue plate protruding from the base part forwardly. The tongue plate includes a first tongue plate and a second tongue plate connecting the base part with the first tongue plate, wherein the first tongue plate is thicker than the second tongue plate. The shielding base contains a horizontal shielding plate, a pair of covering plates, and a pair of connecting plates; the horizontal shielding plate is arranged between the first terminal group and the second terminal group in the tongue plate; the covering plates are arranged at the upper side and the lower side of the shielding plate; and the connecting plates are connected to the shielding plate and the covering plates. The covering plates and the connecting plates encircle the outer sides of the first terminal group and the second terminal group. Each covering plate contains a front plate arranged on the second tongue plate, a rear plate arranged at the rear of the front plate, and a middle plate connecting the front plate and the rear plate; and the connecting plates are connected to the left end and the right end of the rear plate and are staggered at all directions. Therefore, the signal interference between the terminal groups and the external electromagnetic interference can be prevented.

An endoscopic X-ray luminescence tomography device, comprising: an excitation source unit (1), used to excite a probe inside an object under inspection from an external excitation source; a signal acquisition unit (2), used to collect the probe of the object under inspection The X-ray image and the near-infrared light signal image emitted after the probe is excited; the calculation unit (4) is used to preprocess the collected X-ray image and infrared light signal image, and to preprocess the X-ray image Sparse reconstruction is performed to obtain the structural information of the inspected object and the position information of the endoscopic probe in the signal acquisition unit inside the inspected object, and the preprocessed near-infrared light signal image is processed by using the obtained structural information and position information Perform optical three-dimensional reconstruction to obtain the position information and distribution information of the target inside the object under inspection.

The invention discloses a packaging module, a preparation method thereof, a base station and electronic equipment. The packaging module comprises a substrate, a chip located on the substrate, a first plastic packaging layer, a wiring layer located on the plastic packaging layer, and a plurality of interconnection electrodes, a second plastic packaging layer and a conductive layer which are located on the wiring layer. The interconnection electrodes are electrically connected with the wiring layer, and the conductive layer is located on the second plastic packaging layer and comprises a grounding welding pad and a signal transmission welding pad electrically connected with the plurality of interconnection electrodes. In the packaging module, the interconnection electrodes can adjust the height of the cavity, so that the self-excitation problem of the power amplifier can be avoided. And the grounding welding pad in the conductive layer can shield the radio frequency signal on the wiring layer, so that the signal interference problem between the chip and the power amplification plate can be improved. Besides, as only the signal transmission welding pad for providing input/output signals for the chip needs to be arranged in the conducting layer, and wiring does not need to be arranged, enough area can be provided for arranging the grounding welding pad, and the occupied area of the packaging module can not be increased.

A method and apparatus is provided for enhanced signal interference monitoring by sampling a signal of interest and using a representation of the sampled signal in combination with certain audio output capabilities to determine the nature of either the primary received data signal or the secondary interfering signals without requiring any specialized, dedicated external equipment, additional hardware and/or disturbing the primary functions of a radio modem.

The invention provides a wire tidying device which comprises a main body and one or more shielding covers. The main body is provided with multiple mutually-independent and parallelly-arranged wire tidying grooves, the shielding covers cover the open end of at least one wire tidying groove. Due to the fact that the multiple mutually-independent and parallelly-arranged wire tidying grooves are formed, different type of cables can be independently stored in the different wire tidying grooves and can be isolated mutually, signal interference of the different type of cables is effectively avoided, the storage reliability of the wire tidying device is improved, the occupied area of the cables is effectively decreased, and the cables can be easily stored. Due to the fact that the shielding covers are arranged at the open end of at least one wire tidying groove, signals of the wire tidying grooves covered by the shielding covers are not easily scattered to the outside, the cables are not mutually interfered, signal interference of the different type of cables is further shielded, and the using safety of the wire tidying device is improved.

The embodiment of the invention discloses a circuit for improving co-existence and co-frequency interference of functional modules. The circuit comprises a WIFI module, a Bluetooth module, a ZigBee module, a power amplification module and a logic circuit module; the logic circuit module is connected with each module; the WIFI module is connected with the power amplification module; the WIFI moduleis used for sending a first priority control signal and a first activation signal and receiving a first closing request signal; the Bluetooth module is used for sending a second priority control signal and a second activation signal and receiving a second closing request signal; the ZigBee module is used for sending a third priority control signal and a third activation signal and receiving a third closing request signal; the power amplification module is used for amplifying and outputting signals of the WIFI module; and the logic circuit module is used for receiving priority control signalsand activation signals corresponding to the WIFI module, the Bluetooth module and the ZigBee module, and sending corresponding closing request signals to each module after operation so as to control the working priority and the starting and stopping time of each module. The problem of co-frequency interference of functional modules is solved.

A method for manufacturing a through substrate via (TSV) structure, a TSV structure, and a control method of a TSV capacitance are provided. The method for manufacturing the TSV structure includes: providing a substrate having a first surface and a second surface; forming a trench in the first surface of the substrate; filling a low resistance material into the trench; forming an insulating layer on the first surface of the substrate; forming at least one opening in the first surface of the substrate, wherein the opening is located differently the trench; forming an oxide liner layer, a barrier layer and a conductive seed layer on a sidewall and a bottom of the opening and on the insulating layer of the first surface; and filling a conductive material into the opening. Thus, the through substrate via (TSV) structure can reduce a noise problem of the substrate.