Adhesive and preparation method and use method thereof, light screen film and FPC

A technology of adhesives and light films, applied in the direction of adhesives, adhesive types, other rubber adhesives, etc., can solve the problems of difficult recruitment and high labor costs, achieve good signal shielding effect and anti-interference performance, reduce Labor cost, reduced cleaning effect

Inactive Publication Date: 2018-11-30
SHENZHEN KNQ SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, nowadays, people's requirements for electronic components have increased, and the thickness of electronic components is required to be smaller and the performance is higher and higher; with the promotion of 5G, FPC material manufacturers have more and more stringent requirements for the manufacture of FPC; In the manufacturing process of FPC, many processes are difficult to be replaced by robots, and the labor cost is high. Now it is more and more difficult to recruit talents; now there is an urgent need to improve the manufacturing efficiency of FPC, shorten the process, reduce labor costs, and improve FPC shielding signal and anti-interference performance. Strengthen the protection of FPC circuit design and shield unnecessary light for FPC

Method used

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  • Adhesive and preparation method and use method thereof, light screen film and FPC
  • Adhesive and preparation method and use method thereof, light screen film and FPC
  • Adhesive and preparation method and use method thereof, light screen film and FPC

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] An adhesive, comprising the following raw materials by weight percentage: 10% rubber, 10% flame retardant, 3% curing agent, 0.05% ion scavenger, 0.1% antioxidant, 0.1% accelerator, 15% resin, carbon Powder 30% and Thinner 31.75%.

[0039] Adhesive raw material preparation instructions:

[0040] Rubber: 10% rubber, 90% thinner, 1072cgj for rubber, and MEK for thinner.

[0041] Flame retardant: 40% of rubber in this embodiment, 20% of flame retardant, 40% of diluent, OP935 is used for flame retardant, and MEK is used for diluent.

[0042] Curing agent: curing agent 20%, thinner: 80%, the curing agent is DDS, and the thinner is MEK.

[0043] Ion trapping agent: the rubber 10% of the present embodiment, ion trapping agent 40%, diluent 50%, ion trapping agent selects IXE-100 for use, diluent selects MEK for use.

[0044] Antioxidant: Antioxidant 20%, diluent 80%, diluent chooses MEK.

[0045] Accelerator: Accelerator 20%, Thinner 80%.

[0046] Resin: 40% resin, 60% dilu...

Embodiment 2

[0056] An adhesive, comprising the following raw material composition in weight percentage: 15% rubber, 12% flame retardant, 5% curing agent, 0.1% ion scavenger, 0.5% antioxidant, 0.5% accelerator, 20% resin, carbon Powder 40% and Thinner 6.9%.

[0057] Adhesive raw material preparation instructions:

[0058] Rubber: 30% rubber, 70% thinner, 1072cgj for rubber, and MEK for thinner.

[0059] Flame retardant: 50% of rubber in this embodiment, 30% of flame retardant, 20% of diluent, OP935 is used for flame retardant, and MEK is used for diluent.

[0060] Curing agent: curing agent 40%, thinner: 60%, the curing agent is DDS, and the thinner is MEK.

[0061] Ion trapping agent: the rubber 20% of the present embodiment, ion trapping agent 60%, diluent add 20%, ion trapping agent selects IXE-100 for use, diluent selects MEK for use.

[0062] Antioxidant: Antioxidant 40%, diluent 60, diluent selects MEK.

[0063] Accelerator: Accelerator 30%, Thinner 70%.

[0064] Resin: 60% resi...

Embodiment 3

[0074] An adhesive, comprising the following raw material composition in weight percentage: 12.5% ​​of rubber, 11% of flame retardant, 4% of curing agent, 0.075% of ion scavenger, 0.3% of antioxidant, 0.3% of accelerator, 17.5% of resin, carbon Powder 35% and Thinner 19.325%.

[0075] Adhesive raw material preparation instructions:

[0076] Rubber: 20% rubber, 80% thinner, 1072cgj for rubber, and MEK for thinner.

[0077] Flame retardant: 45% of rubber in this embodiment, 25% of flame retardant, 30% of diluent, OP935 is used for flame retardant, and MEK is used for diluent.

[0078] Curing agent: curing agent 30%, thinner: 70%, the curing agent is DDS, and the thinner is MEK.

[0079] Ion trapping agent: the rubber 15% of the present embodiment, ion trapping agent 50%, diluent add 35%, ion trapping agent selects IXE-100 for use, diluent selects MEK for use.

[0080] Antioxidant: Antioxidant 30%, diluent 70%, diluent chooses MEK.

[0081] Accelerator: Accelerator 25%, Thinn...

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Abstract

The invention discloses an adhesive and a preparation method and a use method thereof, a light screen film and an FPC, and relates to the field of FPC. The adhesive comprises the following raw materials by the weight percentage: 10%-15% of rubber, 10%-12% of a flame retardant, 3%-5% of a curing agent, 0.05%-0.1% of an ion trapping agent, 0.1%-0.5% of an antioxidant, 0.1%-0.5% of an accelerant, 15%-20% of resin, 30%-40% of carbon powder and 6.9%-31.75% of a diluent. The FPC adopts the light screen film prepared with the adhesive, the manufacturing process of the FPC is shortened, the labor costis reduced, and the total thickness of the FPC is reduced; the light screen film shields signals and resists interference for the FPC, can shield unnecessary light rays, and greatly improves the protection of FPC circuit design.

Description

technical field [0001] The invention relates to the field of FPC, in particular to an adhesive, its preparation method, its use method, light screen film and FPC. Background technique [0002] In the FPC industry, after CCL is etched, a cover film or protective film or ink is used to cover the surface circuit, so as to protect or increase the thickness of the board. However, nowadays, people's requirements for electronic components have increased, and the thickness of electronic components is required to be smaller and the performance is higher and higher; with the promotion of 5G, FPC material manufacturers have more and more stringent requirements for the manufacture of FPC; In the manufacturing process of FPC, many processes are difficult to be replaced by robots, and the labor cost is high. Now it is more and more difficult to recruit talents; now there is an urgent need to improve the manufacturing efficiency of FPC, shorten the process, reduce labor costs, and improve ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J121/00C09J11/04B32B15/01B32B7/12
Inventor 由龙曾娜顾婧文
Owner SHENZHEN KNQ SCI & TECH CO LTD
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