173results about How to "Improve electromagnetic interference" patented technology

An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its lower surface, a heat spreader attached to the rear side of the semiconductor chip and covering the upper surface of the board, and external contact terminals including ground terminals and signal terminals formed on the bump pads. The contact pads of the board include ground contact pads connected with the ground terminals and signal contact pads connected with the signal terminals. The heat spreader includes indented parts to expose the signal contact pads and protruded parts to cover the ground contact pads which are exposed through holes formed on the protruded parts on the peripheral part of the heat spreader. The semiconductor package can alternatively have the heat spreader attached to the lower surface of the board.

A flat panel display including a first mold frame and a bottom chassis. The first mold frame includes a first base plate with an inside region opened and a plurality of first coupling members protruding from a rear side of the first base plate. The bottom chassis includes a second base plate, a plurality of sidewalls extending from the second base plate and a plurality of second coupling members formed on the plurality of sidewalls and coupled with the plurality of first coupling members.

The present invention provides a resin composition comprising a thermoplastic resin (A), an inorganic compound having a volume resistance of less than about 10⁻³ Ω·m and relative permeability of more than about 5,000 (B) and fiber filler (C). The resin composition of the present invention can have high impact strength and high electrical conductivity, and high electromagnetic interference (EMI) and radio frequency interference (RFI) shielding properties. The resin composition of the present invention can accordingly have multiple functions and can be used for electrical/electronic devices.

An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.

A method for improving electromagnetic interference of liquid crystal display includes utilizing time sequence controller to provide the first frequency single and the second frequency signal in point to point transistor logic interface of time sequence controller and source electrode actuator, setting phase of the first frequency signal to be different to phase of the second frequency signal, transmitting a numbers of the first image data to source electrode actuator by time sequence controller according to the first frequency signal and transmitting a numbers of the second image data to source electrode actuator according to the second frequency signal.

The invention discloses a voltage-type wireless power supply system load identification method. The voltage-type wireless power supply system load identification method comprises the following steps: establishing an inductively power transfer (IPT) system, a primary side circuit sampling circuit obtains 2N primary side resonance current peak values and system working frequency sampling values in a free resonance state and computes total active wear portion RX generated by a secondary side circuit. Whether a non-mutual-inductance-coupling value M exists or not can be judged by comparison of the RX with a primary side coil internal resistance value Rp. If the non-mutual-inductance-coupling value M exists, a load resistance value Re q can be computed. The voltage-type wireless power supply system load identification method has the obvious advantages of being capable of detecting changes of oscillation frequency and the primary side resonance current peak values in a period of a free resonance mode by utilizing two basic modes, namely energy filling and free resonance, and therefore whether load exists or not and power grades of the load when the load exists can be identified.

A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

When a drive signal that is a PWM input signal is small (when the drive duty component of the PWM drive signal is small), shoot-through (through state) between the upper transistor and lower transistor can occur when there is variation in the drive circuit or transistors. An upper switching device and lower switching device control current supply to a load, and an upper drive circuit and lower drive circuit respectively drive the upper switching device and lower switching device. The upper drive circuit has an input terminal that receives a control signal that turns the upper switching device on or off; an upper source circuit that SOURCE outputs a drive current to the control terminal of the upper switching device according to a first level or second level signal applied to the input terminal; an upper sink circuit that SINK outputs drive current to the control terminal of the upper switching device according to a second level or first level signal applied to the input terminal; an upper sink transistor that sinks capacitive current through the control terminal when the upper switching device is off; an upper interface circuit that generates a first input drive signal to the upper source circuit according to the input terminal signal, and a second input drive signal to the upper sink circuit or the upper sink transistor; and a selector that selectively supplies the second input drive signal to the upper sink circuit or the upper sink transistor based on a signal from the inverter. The lower drive circuit is identically configured.

An air filtering apparatus includes a housing defining a top opening and having a front portion defining a bottom opening. A filter is positioned within the top opening and sealed to the housing so that air flowing into the housing passes through the filter. An expansion chamber is in fluid communication with the bottom opening. A motorized fan is located within the housing and is configured for drawing air through the filter, into the housing and out through the expansion chamber. The air output of the motorized fan is directed toward a bottom of the housing proximate a rear of the housing with the expansion chamber extending from the air output of the motorized fan to the front portion of the housing.

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

A shield case includes: a receiving unit which defines a space in which a circuit board is accommodated, where the receiving unit includes a bottom surface and a plurality of side surfaces extending from the bottom surface; and a flange extending from a side surface of the side surfaces in a direction opposite to the circuit board.

The invention discloses a high-temperature resistant FBG (fiber bragg grating) sheet type strain sensor and a manufacturing method thereof. The strain sensor consists of an FBG, a polyimide film, an armored cable and an optical fiber connector, wherein the FBG is connected with the polyimide film; the armored cable is connected with the FBG; the optical fiber connector is connected with the armored cable; and when the strain of a structural component is monitored, the surface of the monitored object needs to be milled by abrasive paper, and the polyimide and FBG composite sheet is stuck on the monitored object with adhesives. The method adopts a polyimide curing technology and comprises the following steps of: sealing the FBG and polyimide into a mould, and organically combining through heating, curing and cooling to form a polyimide and FBG composite sheet; leading out the armored cable from the end part of the polyimide and FBG composite sheet; and sticking the polyimide and FBG composite sheet on the surface of the structural component to be monitored by use of high-temperature resistant adhesives. The strain sensor disclosed by the invention resists high temperature, has good durability and high measurement accuracy, and is in quasi-distributed arrangement, free from electromagnetic interference and convenient to construct.

Provided is a rotating machine parameter telemetering method and a system based on the wireless laser communication, including a rotor 1, a wireless laser communication transmitting module 2, a wireless laser communication receiving module 3, a signal transferring module 4, an optical fiber communication transmitting module 5, an optical fiber 6, a computer 7 with an optical fiber interface, a high speed cable 8 and a signal coding module 9 and the like. On the rotor, the wireless laser communication transmitting module performs the electro-optical transmission to the remote control data after being coded, on the ground, the wireless laser communication receiving module performs the electro-optical transmission to the received optical signals to obtain the remote metering signal without being coded, and further the signals are transmitted to the computer for coding and analysis through the signal transferring module, the optical fiber communication transmitting module and the optical fiber. The invention has the advantages of non-contact measurement, high data transmission rate, no electromagnetic interference and high reliability, which can satisfy the high speed parameter telemetering requirement of the rotating machine, such as the aeroengine and the like.

The invention relates to a modularized flat display unit, comprising casing, display screen, display screen-drive functional module and external terminals, where the functional module is arranged in a box, and the box is removably installed on one side of the casing, and the external terminals are arranged on one side of the box. Thus, it reduces the design cost, and makes maintenance convenient. Besides, the external terminals are inclinedly arranged on the box to be able to effectively reduce parts of the wire projecting from the box so as to reduce the required installation space for the flat display unit; the flat display unit further adopts ''T''-shaped support device to effectively use vertical and cross bars to support the whole display unit, solving the problem that the support strength is not enough.