Shading film and FPC (flexible circuit board)

A technology of light-shielding film and adhesive, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of high labor cost and difficulty in recruiting talents, and achieve the effect of reducing labor cost and good signal shielding effect. and anti-interference performance, the effect of shortening the manufacturing process

Inactive Publication Date: 2018-11-06
SHENZHEN KNQ SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, nowadays, people's requirements for electronic components have increased, and the thickness of electronic components is required to be smaller and the performance is higher and higher; with the promotion of 5G, FPC material manufacturers have more and more stringent requirements for the manufacture of FPC; In the manufacturing process of FPC, many processes are difficult to be replaced by robots, and the labor cost is high. Now it is more and more difficult to recruit talents; now there is an urgent need to improve the manufacturing efficiency of FPC, shorten the process, reduce labor costs, and improve FPC shielding signal and anti-interference performance. Strengthen the protection of FPC circuit design and shield unnecessary light for FPC

Method used

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  • Shading film and FPC (flexible circuit board)
  • Shading film and FPC (flexible circuit board)
  • Shading film and FPC (flexible circuit board)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as figure 1 As shown, a light-shielding film includes a black PI layer 1, a black glue layer 2 and a copper foil 3, and the black PI layer 1, the black glue layer 2 and the copper foil 3 are sequentially coated and bonded by an adhesive, and the The adhesive comprises the following raw materials in percentage by weight: rubber 10%, flame retardant 10%, curing agent 3%, ion trapping agent 0.05%, antioxidant 0.1%, accelerator 0.1%, resin 15%, carbon powder 30% and Thinner 31.75%.

[0038] The black PI layer 1 is made of black matte PI. The copper foil 3 is electrolytic copper foil.

[0039] Adhesive raw material preparation instructions:

[0040] Rubber: 10% rubber, 90% thinner, 1072cgj for rubber, and MEK for thinner.

[0041] Flame retardant: 40% of rubber in this embodiment, 20% of flame retardant, 40% of diluent, OP935 is used for flame retardant, and MEK is used for diluent.

[0042] Curing agent: curing agent 20%, thinner: 80%, the curing agent is DDS, and...

Embodiment 2

[0053] Such as figure 1 As shown, a light-shielding film includes a black PI layer 1, a black glue layer 2 and a copper foil 3, and the black PI layer 1, the black glue layer 2 and the copper foil 3 are sequentially coated and bonded by an adhesive, and the The adhesive comprises the following raw materials in weight percentage: 15% rubber, 12% flame retardant, 5% curing agent, 0.1% ion trapping agent, 0.5% antioxidant, 0.5% accelerator, 20% resin, 40% carbon powder and Thinner 6.9%.

[0054] The black PI layer 1 is made of black matte PI. The copper foil 3 is electrolytic copper foil.

[0055] Adhesive raw material preparation instructions:

[0056] Rubber: 30% rubber, 70% thinner, 1072cgj for rubber, and MEK for thinner.

[0057] Flame retardant: 50% of rubber in this embodiment, 30% of flame retardant, 20% of diluent, OP935 is used for flame retardant, and MEK is used for diluent.

[0058] Curing agent: curing agent 40%, thinner: 60%, the curing agent is DDS, and the t...

Embodiment 3

[0069] Such as figure 1 As shown, a light-shielding film includes a black PI layer 1, a black glue layer 2 and a copper foil 3, and the black PI layer 1, the black glue layer 2 and the copper foil 3 are sequentially coated and bonded by an adhesive, and the The adhesive comprises the following raw materials in weight percentage: 12.5% ​​of rubber, 11% of flame retardant, 4% of curing agent, 0.075% of ion trapping agent, 0.3% of antioxidant, 0.3% of accelerator, 17.5% of resin, 35% of carbon powder and Thinner 19.325%.

[0070] The black PI layer 1 is made of black matte PI. The copper foil 3 is electrolytic copper foil.

[0071] Adhesive raw material preparation instructions:

[0072] Rubber: 20% rubber, 80% thinner, 1072cgj for rubber, and MEK for thinner.

[0073] Flame retardant: 45% of rubber in this embodiment, 25% of flame retardant, 30% of diluent, OP935 is used for flame retardant, and MEK is used for diluent.

[0074] Curing agent: curing agent 30%, thinner: 70%,...

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PUM

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Abstract

The invention discloses a shading film and relates to the field of an FPC (flexible circuit board). The shading film comprises a black PI (polyimide) layer, a black rubber layer and copper foil, wherein the black PI layer, the black rubber layer and the copper foil are sequentially coated with an adhesive for adhesion, and the adhesive is prepared from raw materials in percentage by weight as follows: 10%-15% of rubber, 10%-12% of a flame retardant, 3%-5% of a curing agent, 0.05%-0.1% of an ion catcher, 0.1%-0.5% of an antioxidant, 0.1%-0.5% of an accelerant, 15%-20% of resin, 30%-40% of carbon powder and 6.9%-31.75% of a diluent. The invention further discloses the FPC. The shading film and the FPC have good signal shielding effect and anti-disturbance performance and can block unnecessary light.

Description

technical field [0001] The invention relates to the field of FPCs, in particular to a light-shielding film and an FPC. Background technique [0002] In the FPC industry, after CCL is etched, a cover film or protective film or ink is used to cover the surface circuit, so as to protect or increase the thickness of the board. However, nowadays, people's requirements for electronic components have increased, and the thickness of electronic components is required to be smaller and the performance is higher and higher; with the promotion of 5G, FPC material manufacturers have more and more stringent requirements for the manufacture of FPC; In the manufacturing process of FPC, many processes are difficult to be replaced by robots, and the labor cost is high. Now it is more and more difficult to recruit talents; now there is an urgent need to improve the manufacturing efficiency of FPC, shorten the process, reduce labor costs, and improve FPC shielding signal and anti-interference p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06B32B15/20B32B15/04B32B27/28B32B27/06B32B7/12B32B33/00
Inventor 由龙曾娜顾婧文
Owner SHENZHEN KNQ SCI & TECH CO LTD
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