SMP connector jack depth position dimension measuring device

A depth position and measurement device technology, applied in the direction of mechanical depth measurement, etc., can solve the problems of occupying a lot of resources, difficult to meet the needs of mass production, low efficiency, etc., and achieve the effect of light structure, simple structure and convenient use

Inactive Publication Date: 2020-09-25
CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method not only takes up a lot of resources, but also has extremely low efficiency, so it is difficult to meet the needs of mass production

Method used

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  • SMP connector jack depth position dimension measuring device
  • SMP connector jack depth position dimension measuring device
  • SMP connector jack depth position dimension measuring device

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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] In the description of the present invention, it should be noted that, unless otherwise specified and limited, the terms "installed", "set with", "sleeved / connected", "connected", etc. should be understood in a broad sense, such as " Connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an inte...

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Abstract

The invention discloses an SMP connector jack depth position dimension measuring device. The invention relates to the technical field of measuring devices. The device comprises a clamp body, a digitaldisplay dial indicator, a guide rod, a measuring head and an outer measuring sleeve. The clamp body is arranged to be of a hollow cylinder structure, and the guide rod and the measuring head are mounted in a guide hole in the clamp body in a sliding manner. The guide rod is mounted at the top of the measuring head. The digital display dial indicator is arranged at the other end of the guide rod,the end of the digital display dial indicator extends into the guide hole of the clamp body and is in contact with the upper surface of the guide rod all the time, and the outer measuring sleeve is connected to the outer wall of the lower end of the clamp body. The device is only composed of seven simple parts, simple and light in structure, capable of being operated by hand and particularly convenient to use; in addition, the measurement result can be directly displayed through the digital display dial indicator, the measurement efficiency is very high; and in addition, the outer measuring sleeve, the measuring head and the digital display dial indicators with different measuring ranges can be replaced, so that the applicability is high, and various measurement requirements can be met.

Description

technical field [0001] The invention relates to the technical field of measuring devices, in particular to a measuring device for the depth, position and dimension of an SMP connector socket. Background technique [0002] SMP connectors are widely used in various electronic products, especially in radar products. In the past, the depth of the plug hole of the SMP connector relative to the component substrate was usually determined by the machining accuracy of the parts themselves to ensure the precision requirements of the assembled component, so no measurement was required. However, with the development of radar products towards high precision and high integration, the integration and precision requirements of components are also getting higher and higher, which involves the depth control of the socket relative to the substrate after the SMP connector and components are welded. The specific content is to control the depth dimension from the bottom surface of the plug hole ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B5/18
CPCG01B5/18
Inventor 黄剑波
Owner CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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