Manufacturing method of two-stage graded golden finger

Abstract

A manufacturing method of a two-stage graded golden finger comprises the following steps: etching an outer layer, keeping a copper layer in an area where the golden finger and a lead are located not to be etched, etching off the copper layer in a graded area of the golden finger, and obtaining a first prefabricated plate after etching is finished; coating ink on the first prefabricated plate, andnot shielding the area where the golden finger is located, so that a second prefabricated plate is obtained; plating nickel gold on the area where the golden finger is located on the second prefabricated plate to obtain a third prefabricated plate; removing ink on the third prefabricated slab by washing to obtain a fourth prefabricated slab; coating ink on the fourth prefabricated slab, and not shielding the area where the lead is located, so that a fifth prefabricated slab is obtained; and etching off the lead on the fifth prefabricated plate, and then removing the ink on the fifth prefabricated plate to obtain the two-stage graded golden finger. Compared with the prior art, the two-stage graded golden finger manufactured by the method has the advantages that the possibility of nickel andgold plating at the graded position is eliminated, the problems of gold seepage at the electroplated gold graded position and short circuit at the graded position are greatly improved, and the product yield is remarkably improved.

Description

technical field [0001] The invention relates to the technical field of PCB board manufacturing, in particular to a two-stage graded gold finger manufacturing method. Background technique [0002] On the printed circuit board near the edge of the board, there are many rectangular metal contacts arranged in rows, and the metal contacts are formed by electroplating a layer of nickel gold on the copper surface of the printed circuit board. These metal contacts are part of the printed circuit board and are called gold fingers because of their nickel-gold-plated surface and their shape resembling fingers. Gold fingers are used for connection between printed circuit boards, capable of connecting circuits and transmitting signals. The nickel-gold layer on the surface of the gold finger can improve the insertion resistance, conductivity and oxidation resistance of this part. Cheats are generally divided into equal-length cheats, graded cheats and segmented cheats. The design of gra...

AI Technical Summary

Problems solved by technology

However, the quality control of the photosensitive oil bridge is difficult. There is a case of gold seepage when the gold is electroplated at the grading point, which leads to a short circuit between the two stages, which seriously affects the yield rate of the two-stage grading gold finger.

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