Interstage matching network circuit and radio frequency power amplifier

Abstract

The embodiment of the invention provides an inter-stage matching network circuit and a radio frequency power amplifier, and the inter-stage matching network circuit uses a first bonding wire and a second bonding wire to tune the total inductance value of the inter-stage matching network circuit. Due to the fact that a certain space exists between the first bonding wire and the substrate integrated with the inter-stage matching network circuit and between the second bonding wire and the substrate integrated with the inter-stage matching network circuit, loss of electromagnetic waves in air is minimum, and the problem of electromagnetic wave loss caused by the substrate is avoided. The inter-stage matching network circuit is used for reducing inductance loss, and for the radio frequency power amplifier applying the inter-stage matching network circuit, the gain amplitude of the radio frequency power amplifier is increased. The communication device applying the radio frequency power amplifier realizes the final output maximum peak power on the premise of lower power consumption.

Description

technical field [0001] The present application relates to the field of integrated circuits, in particular to an interstage matching network circuit and a radio frequency power amplifier. Background technique [0002] Radio frequency (radio frequency, RA) power amplifier (power amplifier, PA) is an important component of communication devices. At present, radio frequency integrated circuit (radio frequency integrated circuit, RFIC) is an evolution direction of radio frequency power amplifier. RFIC has the advantages of miniaturization and Integrated features. [0003] In order to achieve greater output power and higher gain of RF power amplifiers, multi-stage power amplifiers are usually cascaded. In order to achieve power and impedance matching among multiple stages, an inter-stage matching network (inter stage matching network, ISMN) needs to be used between the two-stage power amplifiers. Taking the inter-stage matching network integrated in a laterally-diffused metal-ox...

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