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Alignment apparatus and substrate processing apparatus including the same

A substrate processing device and alignment device technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as arcing and detachment

Pending Publication Date: 2021-08-24
PSK HLDG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Otherwise, the above-mentioned arcing phenomenon may occur due to the warping phenomenon of the panel S not being removed
In addition, when the transfer manipulator transports the window clamp W, panel S and jig plate J, the window clamp W, panel S and jig plate J may be detached from the transfer manipulator.

Method used

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  • Alignment apparatus and substrate processing apparatus including the same
  • Alignment apparatus and substrate processing apparatus including the same
  • Alignment apparatus and substrate processing apparatus including the same

Examples

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Embodiment Construction

[0088] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art to which the present invention pertains can easily implement. However, the present invention can be implemented in various forms, and is not limited to the embodiments described here. In addition, in describing the preferred embodiments of the present invention in detail, if it is judged that the detailed description of related known functions or configurations may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, in all the drawings, the same reference numerals are used for parts that perform similar functions and roles.

[0089] Unless otherwise specifically stated, "comprising" a certain constituent element means that other constituent elements may be further included, not excluded. Specifically, terms such as "comprising" or "having" should b...

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PUM

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Abstract

The invention provides an alignment apparatus and a substrate processing apparatus including the same. The alignment device may include: a support module supporting each object at different heights; and an alignment module that aligns the objects supported by the support module, the alignment module may include: a first alignment portion that aligns a first object that is one of the objects; a second alignment unit that aligns a second object that is one of the objects and is different from the first object; and a drive unit that moves the first alignment unit and the second alignment unit simultaneously.

Description

technical field [0001] The present invention relates to an alignment device and a substrate processing device including the alignment device. Background technique [0002] As semiconductor chips are highly integrated, their size gradually decreases. On the other hand, the interval between solder balls on a semiconductor chip is determined by the international standard of the World Semiconductor Standards Association. Therefore, it is not easy to adjust the number of solder balls of the semiconductor chip. In addition, as semiconductor chips become smaller, handling becomes difficult, and testing also becomes difficult. Meanwhile, there is a problem that board materials to be mounted need to be diversified according to the size of the semiconductor chip. In order to solve this problem, a fan-out panel level package (Fan Out Panel Level Package, FOPLP) is proposed. [0003] Generally, the surface treatment process of a fan-out panel (Fan Out Panel) for a fan-out panel leve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L21/687
CPCH01L21/68H01L21/68742H01L21/68785H01L21/67207H01L21/67069H01L21/67028
Inventor 朴锺范
Owner PSK HLDG INC
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