A high frequency array transducer

A transducer and array technology, applied in the field of high-frequency array transducers, to achieve the effect of increasing the complexity and difficulty of the process

Active Publication Date: 2022-07-08
SHENZHEN INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In view of this, in order to overcome the defects of the above-mentioned prior art, the present invention proposes an array transducer, which can produce a higher frequency array transducer without increasing the complexity and difficulty of the process

Method used

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  • A high frequency array transducer
  • A high frequency array transducer
  • A high frequency array transducer

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Experimental program
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Effect test

Embodiment 1

[0041] This embodiment provides a specific connection structure between the flexible circuit board assembly and the piezoelectric layer 2 . See attached manual figure 2 , the piezoelectric layer 2 is arranged between the two insulating layers 3, and each piezoelectric array element 23 has a first electrode located on the first electrode surface 21 and a second electrode located on the second electrode surface 22, respectively. The piezoelectric layer The first electrode surface 21 on 2 extends to cover one side surface of the insulating layer 3 , and the second electrode surface 22 extends to cover the other side surface of the insulating layer 3 , and shares an electrode with the insulating layer 3 . In this embodiment, the flexible circuit board assembly includes a first flexible circuit board assembly 51 and a second flexible circuit board assembly 52 , and the flexible circuit board assembly is bonded on the insulating layer 3 .

[0042] It can be that the first flexible...

Embodiment 2

[0047] This embodiment provides a circuit connection method of an array transducer applying the wiring method of the present invention. see Figure 3-Figure 6 , the piezoelectric array elements 23 are staggered on the upper and lower sides of the piezoelectric layer 2 through the flexible circuit board assembly, and the electrode lead units are placed at intervals. Specifically, any two electrode lead units are not on the same straight line. By placing the first electrode lead unit 511 on the same side on the first electrode face 21 and the second electrode lead unit 521 on the same side on the second electrode face 22, the first electrode lead unit 511 and the second electrode lead unit 511 The units 521 are arranged on opposite sides to expand the spacing between adjacent electrode lead units on the flexible circuit board assembly; the first electrode lead units 511 can also be alternately arranged on both sides of the first electrode surface 21, and the second The electrod...

Embodiment 3

[0051] See attached manual Figure 7, is a schematic diagram of excitation of an ultrasonic system using the array transducer of the present invention. Taking the array of 8 piezoelectric array elements 23 as an example in the figure, the excitation signal 71 adjusts the sequence and start time of excitation through electronic delays 72 with different time lengths, and controls the working and disconnecting states of the excitation signal 71 through the electronic switch 73, Next, the excitation signal 71 drives the piezoelectric array element 23 of the transducer to work: the piezoelectric array element 23 emits ultrasonic waves to form a focus at the target tissue 74; the ultrasonic echo reflected by the tissue is received by the piezoelectric array element 23 of the transducer, converted into After it is an electrical signal, it is processed to form an ultrasound image.

[0052] The excitation signal 71 driving the piezoelectric array element 23 of the transducer to work i...

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Abstract

The present invention provides an array transducer, comprising an acoustic lens, a matching layer, a first flexible circuit board assembly, a piezoelectric layer, a second flexible circuit board assembly and a backing layer arranged in sequence, the first flexible circuit board assembly and The second flexible circuit board assemblies respectively include at least one flexible circuit board, the first electrode surface and the second electrode surface of the piezoelectric layer respectively have electrodes, and the electrodes on each side surface of the first electrode surface and the second electrode surface are cut so that the The piezoelectric layer forms a plurality of piezoelectric array elements; the first flexible circuit board assembly is arranged on the first electrode surface, the first flexible circuit board assembly leads out a plurality of first electrode lead units, and at least a pair of adjacent piezoelectric array elements share the same Connect the same first electrode lead unit; the second flexible circuit board assembly is arranged on the second electrode surface, and the second flexible circuit board assembly leads out a plurality of second electrode lead units, and at least a pair of adjacent piezoelectric array elements share the same Connect the same second electrode lead unit.

Description

technical field [0001] The invention relates to the technical field of ultrasonic transducers, in particular to a high-frequency array transducer. Background technique [0002] Ultrasound imaging technology is an important means of diagnosing diseases through medical imaging. It mainly transmits ultrasonic waves into the human body through the ultrasonic transducer, and performs linear, sectoral or other forms of scanning. When encountering the interface of two tissues with different acoustic impedances, the ultrasonic waves will be reflected back and received by the transducer. Processed, displayed on the screen, to form a tomographic image of the human body, called an ultrasonogram, for clinical diagnosis. Continuous multiple ultrasound images are displayed on the screen, and dynamic organ activity can be observed. Due to the difference in the depth of the interface between the organs and tissues in the body, the echoes are received in the past and after, so that the dep...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): B06B1/06
CPCB06B1/0662B06B2201/76B06B2201/55
Inventor苏敏张志强潘东文邱维宝
OwnerSHENZHEN INST OF ADVANCED TECH