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Wafer cleaning module

A wafer, cleaning technology, applied in the direction of cleaning methods and appliances, cleaning methods using gas flow, chemical instruments and methods, etc., can solve problems such as defects

Pending Publication Date: 2021-10-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Contaminants can cause defects in ICs during processing

Method used

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  • Wafer cleaning module
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Examples

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Embodiment Construction

[0059] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature on or over a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where the first feature and the second feature may be formed in direct contact. An embodiment in which an additional feature is formed between two features such that the first feature and the second feature may not be in direct contact. Additionally, the present disclosure may repeat element symbols and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between t...

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Abstract

A wafer cleaning module and a method of cleaning a wafer by the wafer cleaning module are disclosed. For example, the wafer cleaning module includes: a wafer chuck configured to hold a wafer; an ozone source configured to provide ozone gas to the wafer; and an ultraviolet (UV) lamp module configured to provide ultraviolet light. The ultraviolet lamp module includes an ultraviolet light source and a rotatable mirror surrounding the ultraviolet light source. The rotatable mirror is movable in order to adjust the amount of ultraviolet light directed to the wafer surface.

Description

technical field [0001] The present disclosure relates to a wafer cleaning module. Background technique [0002] The semiconductor integrated circuit (IC, Integrated Circuit) industry has experienced exponential growth. As IC materials and designs have advanced, faster and smaller circuits have been produced. Circuits have become more complex because there are more interconnects within a smaller IC area. [0003] Processing a substrate to form an IC may include several different fabrication steps. Between certain fabrication steps, the substrate may be cleaned to remove contaminants or residues before the substrate may proceed to the next fabrication step of the IC fabrication process. Contaminants can cause defects in the IC during processing. Thus, the cleaning step may remove undesired contaminants, debris, etc. from the surface of the substrate or layers on the substrate to prevent the presence of defects. Contents of the invention [0004] According to some embodi...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67028H01L21/67115B08B5/00B08B7/0057B08B7/04B08B13/00H01L21/02057
Inventor 林震洋刘仲轩宋古翔林冠文陈嘉仁李信昌
Owner TAIWAN SEMICON MFG CO LTD
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