Novel semiconductor support

Abstract

The invention relates to the technical field of semiconductors, and provides a novel semiconductor support. The support comprises a plate body, a first wall body, a conductive structure, a conductive column and a light-emitting semiconductor element. The plate body is provided with a first surface and a second surface which are opposite to each other, and is made of an insulating material. The first wall body is connected to the first surface of the plate body. The conductive structure is located in the plate body and penetrates through the second surface of the plate body. The conductive column is connected to the conductive structure and penetrates through the first surface of the plate body. The light-emitting semiconductor element is arranged on the first surface of the plate body and located in the first wall body, and the light-emitting semiconductor element is electrically connected to the conductive column. Therefore, excessive use of metal structures is not needed, reflection is reduced to excessively depend on a metal coating, pollution of the metal structures is reduced, and cost is saved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a novel semiconductor support. Background technique [0002] With the development of semiconductor technology and its application in various scenarios in various fields, semiconductor structures meeting various needs have been produced. In semiconductor structures, semiconductor supports are basically used, and in order to meet various needs, semiconductor supports of various sizes, structures and materials are also derived. Traditional light-emitting semiconductor brackets use a large number of metal structures near the semiconductor element to conduct electricity and help reflect light. Due to too many metal structures, metal pollution is serious, the cost is high, and the process is cumbersome. [0003] For example, the Chinese patent (publication number is CN102522477A) discloses a LED packaging structure, which uses too many metal structures such as metal coatings, m...

AI Technical Summary

Problems solved by technology

Traditional light-emitting semiconductor brackets use a large number of metal structures near the semiconductor element to conduct electricity and help reflect light. Due to too many metal structures, metal pollution is serious, the cost is high, and the process is cumbersome.

[0003] For example, the Chinese patent (publication number is CN102522477A) discloses a LED packaging structure, which uses too many metal structures such as metal plating, metal reflective cups, and metal brackets, and there are problems such as serious metal pollution, high cost, and cumbersome processes.

[0004] In addition, the traditional light-emitting semiconductor support has a spacer between the positive and negative electrodes to separate the charges of the positive and negative electrodes and facilitate conduction. However, due to the existence of the spacer, the chip position space in the support will be reduced, which in turn will affect the light-emitting performance of the product.

Traditional light-emitting semiconductor brackets also have problems such as poor light emission and light-gathering effects, easy oxidation of metals, and easy entry of impurities into the bracket, which affects light emission and other problems.

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