Mass transfer Micro LED module, manufacturing method thereof, display screen and manufacturing method of display screen

Abstract

The invention relates to the technical field of displays, and especially relates to a mass transfer Micro LED module, a manufacturing method thereof, a display screen and a manufacturing method of the display screen. The mass transfer Micro LED module comprises a transfer module substrate, three-in-one LED modules are arranged on the transfer module substrate, each three-in-one LED module sequentially comprises a display driving IC layer, a driving control layer and an LED chip layer, and the three-in-one LED modules are arranged on the transfer module substrate in an array mode; and the edge of the substrate of the transfer module is provided with pins used for electrical connection. The invention aims to provide the mass transfer Micro LED module, the display screen and the manufacturing method, which can overcome the problems of low efficiency and yield, poor chip retention precision, stripping caused by different thermal expansion coefficients of a packaging adhesive and a substrate, high IC power consumption and high equipment investment caused by a mass transfer process of an LED chip.

Description

【Technical field】 [0001] The present application relates to the field of display technology, in particular to a mass transfer Micro LED module, a display screen and a manufacturing method. 【Background technique】 [0002] As people's requirements for high-definition display screens are getting higher and higher, small-pitch display screen products are developing rapidly, and the pitches are getting smaller and smaller. At present, the common small-pitch RGB display products mainly include the following two types. One is Micro LED display, the chip size is less than 50μm, and the center-to-pixel spacing is less than 0.3mm. Flip-chip packaging is usually used to produce massive transfer; the other is Mini LED display, the chip size is between 50-200μm, and the pixel center spacing is 0.3-1.5mm. Generated by flip-chip packaging, using ordinary or mass transfer methods. Micro LED has become the next-generation mainstream display technology due to its irreplaceable advantages s...

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Problems solved by technology

[0004] The purpose of this application is to provide mass transfer Micro LED modules, display screens and manufacturing methods to overcome the problems of low efficiency and yield rate, poor chip retention accuracy, and differences in thermal expansion coefficients between the packaging glue and the substrate caused by the mass transfer process of LED chips. Stripping, high IC power consumption, and high equipment investment

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