33results about How to "Lower yield" patented technology

The invention discloses a silicide connection layer forming method and a semiconductor device, and the method comprises the steps: providing a semiconductor structure which is made of silicon; forming a protective layer on the semiconductor structure and forming a metal layer on the protective layer; performing an annealing process so that metal particles in the metal layer pass through the protective layer and react with silicon in the semiconductor structure to form an intermediate layer; removing the remaining part of the metal layer under the condition that the protective layer protects the intermediate layer; the annealing process is performed again so that the intermediate layer continues to react with the silicon in the semiconductor structure to form a silicide connection layer, and the protection layer is removed. In the process of removing the residual part of the metal layer, the middle layer is not damaged due to the protection of the protection layer, and the performance of the semiconductor device is improved.

The present application provides a resin material supply device capable of suppressing a decrease in yield of a resin molded product. The present application includes: a table capable of supporting a transfer portion capable of holding and transferring a resin material; a resin housing portion housing the resin material; a resin supply portion supplying the resin material supplied from the resin housing portion to the transfer portion supported by the table; an oscillation portion provided at an upper portion of the resin supply portion, the resin material being supplied from the resin supply portion to the transfer portion by oscillating the resin supply portion; and a metering portion provided at a lower portion of the table, the resin material supplied to the transfer portion being capable of being metered.

The invention discloses a semiconductor structure and a forming method thereof, and the method comprises the steps: a gate structure is arranged on a substrate, a source-drain region is arranged in the substrate at at least one side of the gate structure, and an interlayer dielectric layer is formed on the gate structure and the substrate; a first groove and a second groove are formed in the interlayer dielectric layer, the position of the first groove corresponds to that of the gate structure, and the position of the second groove corresponds to that of the source-drain region; forming a lateral barrier layer on the side wall of the first groove and the side wall of the second groove; dielectric structures are formed in the first groove and the second groove of which the side walls are provided with the lateral barrier layers; a first through hole and a second through hole which penetrate through the dielectric structure and the interlayer dielectric layer in sequence are formed, the first through hole is formed in the gate structure, and the second through hole is formed in the source-drain region. The lateral barrier layer delays the etching rate of the first through hole and the second through hole in the direction parallel to the surface of the substrate, and the phenomenon that the critical sizes of the first through hole and the second through hole are too large due to over-etching at the top positions of the first through hole and the second through hole is effectively reduced.

The present invention provides a laser bar packaging structure and a welding fixture and method. The welding fixture includes: an upper pressing plate and a lower pressing plate aligned in parallel, the upper pressing plate and the lower pressing plate are locked by a screw shaft perpendicular to the upper and lower pressing plates, the lower pressing plate is provided with a narrow groove for accommodating packaging materials, the surface of the upper pressing plate opposite to the narrow groove is provided with a balanced clamping structure, the upper pressing plate and the lower pressing plate have the same area and material, and the thermal expansion coefficient of the screw shaft is smaller than the thermal expansion coefficient of the upper pressing plate and the lower pressing plate. The present invention uses a specially designed welding fixture combined with a low-temperature welding method to weld two heat sinks and laser bars together, thereby reducing the thermal stress caused by high-temperature welding.

The embodiment of the invention discloses a display panel and a display device. The display panel comprises a substrate, an auxiliary functional film layer, a plurality of connecting electrodes, a plurality of first areas and a plurality of second areas, the auxiliary functional film layer is located on the surface of one side of the substrate, and at least part of the structure of the connecting electrode is located on the surface of the side, away from the substrate, of the auxiliary functional film layer; the first areas are overlapped with the area where the connecting electrode is located, and the second area is located between at least two first areas; in the thickness direction of the substrate, the auxiliary function film layer corresponding to the first area and the auxiliary function film layer corresponding to the second area have a thickness difference. According to the display panel, the flowing path of the eutectic material between the adjacent connecting electrodes is prolonged, mutual contact of the eutectic material in the molten state in the flowing process is prevented, and the risk of short circuit / short circuit between the adjacent connecting electrodes caused by flowing and overflowing of the eutectic material in the molten state is reduced.

The invention relates to a photo-hardening conductive composition, which comprises a photo-curing component, a conductive material and a flatting agent. The photocuring component comprises a reactive monomer with an acid ester group, an adhesive and a photoinitiator. And the weight ratio of the adhesive to the reactive monomer with the acid ester group is more than 4. By matching the components of the photo-hardening conductive composition and designing the weight ratio of the adhesive to the reactive monomer with the acid ester group, the conductive hardened material formed by the photo-hardening conductive composition has the advantage of thermal dimensional stability, so that the thermal dimensional stability of the conductive hardened material is improved in the co-sintering process of manufacturing a passive electronic component. The problem of low yield or poor conductivity caused by large size change can be reduced.

The invention discloses a secure parallel upgrading method and system for firmware of embedded equipment based on a CAN bus, electronic equipment and a medium, and belongs to the field of embedded systems.The secure parallel upgrading method comprises the steps that an equipment management server generates an upgrading data packet; the server generates a temporary session key through a key derivation function, encrypts firmware to be upgraded by using the temporary session key, and then generates a digital signature for encrypted firmware data by using a private key of the server; the server issues the upgrade data packet to the embedded device in parallel through a CAN bus; the embedded device receives the upgrade data packet, derives the same temporary session key by using a preset fixed key and the received random number, verifies the digital signature by using a preset server public key, decrypts the firmware data by using the temporary session key after the verification is passed, and performs integrity verification; and finally, loading and operating the new firmware according to the firmware effective strategy. According to the method, the problems of firmware version synchronization and low serial upgrading speed are solved, and the efficiency and the safety are improved.

This utility model provides an automatic positioning and suction bag device for large roll paper packaging bags, relating to the field of packaging bag suction technology. It includes a base plate, a support seat mounted on the top of the base plate, a lifting mechanism on the inner side of the support seat, a first mounting frame mounted above the support seat, a feeding chamber mounted above the first mounting frame, a pressure plate mounted on the inner side of the feeding chamber, and a discharging mechanism below the first suction cup and connecting frame. The device uses a suction bag assembly to replace traditional mechanical gripping. The first and second suction cups use negative pressure to suction the edge of the packaging bag opening, avoiding bag damage or detachment caused by improper gripping force, significantly reducing the packaging bag breakage rate. Simultaneously, the combined action of a laser sensor and a second hydraulic cylinder ensures minimal deviation in the bag picking position, guaranteeing precise alignment of the bag opening with the large roll paper conveying path, greatly reducing the bag-fitting defect rate and subsequent sealing leakage problems.

This invention provides a semiconductor manufacturing process, comprising using a computer system to divide a wafer area into multiple exposure areas and distribute multiple observation points in each exposure area (shot), identifying a portion of boundary areas from all exposure areas, calculating the number of observation points in each boundary area, and eliminating boundary areas with fewer than 3 observation points, counting the observation points in the remaining boundary areas, and deleting a portion of the observation points until the total number of observation points meets a preset total and the observation points are uniformly distributed, and performing an alignment measurement step on the remaining observation points to generate an offset vector map.

The utility model provides a communication PCBA (Printed Circuit Board Assembly) multichannel reflow soldering device which is characterized by comprising a base and a pressing needle cover plate, the base is used for installing a mother board attached with a daughter board, and electronic components are attached to the mother board and the daughter board; a plurality of elastic pressing structures are arranged in the pressing needle cover plate, the pressing needle cover plate covers the mother board and the daughter board and is fixedly connected with the base, and after the pressing needle cover plate and the base are fixed, the elastic pressing structures in the pressing needle cover plate press electronic elements on the daughter board, the mother board and the daughter board. The communication PCBA multi-channel reflow soldering device can solve the problems of insufficient soldering of a neutron plate and a power tube, large welding cavity and the like in multi-channel PCBA reflow soldering.

The utility model relates to the technical field of tools, in particular to a tool for pressing a semicircular check ring on a rotor. A snap spring pushing guide seat is mounted at one end of the snap spring seat, and a check ring is placed on the snap spring seat; a mounting hole for the rotor assembly to insert is formed in the plate surface of the push snap spring guide seat, an insertion hole is formed in the top surface of the push snap spring guide seat, a push snap spring pressing piece is inserted in the insertion hole, and the axes of the push snap spring pressing piece, the check ring and the check ring mounting part in the rotor assembly coincide. The check ring is taken and placed on the guide rod, the snap spring pushing plate is installed and connected through the elastic piece, and the check ring on the guide rod is extruded into the avoiding notch; the rotor assembly is inserted into the mounting hole, and the push clamp spring pressing piece is placed into the insertion hole; the pressing head of the pressing machine is aligned with the snap spring pushing pressing piece, the handle is pressed down, and the check ring is pressed into the rotor snap spring groove of the rotor assembly, so that the labor cost is reduced, the assembly precision is improved, the consistency and stability of finished products are guaranteed, the assembly reject ratio and the assembly practice are reduced, and the efficiency and the productivity of the whole production line are improved.

The invention relates to gallium nitride in-situ stripping equipment and a method for preparing gallium nitride single crystal, the gallium nitride in-situ stripping equipment comprises a reaction cavity with a gas inlet and a gas outlet, and the reaction cavity is provided with a heater capable of controlling the temperature in the reaction cavity. An optical-grade quartz support and an epitaxial substrate which is placed on the optical-grade quartz support and used for epitaxial growth of gallium nitride are installed in the reaction cavity, an optical-grade quartz plate is arranged on the lower portion of the reaction cavity, a laser is arranged below the reaction cavity, the laser emits laser towards the epitaxial substrate, and the optical-grade quartz plate is arranged on the lower portion of the reaction cavity. According to the method, the phenomenon of cracking caused by too large difference of thermal expansion coefficients of gallium nitride and sapphire in the cooling process is avoided, the gallium nitride single crystal after epitaxy can be directly used for grinding and polishing, and the method is suitable for large-scale production. And epitaxy does not need to be performed again, so that working procedures and time are saved.

Systems and methods for detecting micro LED arrays using non-contact field effect electroluminescence are disclosed.

The invention provides a preparation and separation method of an LED epitaxial wafer and an LED chip. According to the LED epitaxial wafer, a first sacrificial layer and a buffer layer structure are arranged between a sapphire substrate and an epitaxial laminated layer; according to the preparation and separation method of the LED chip, an LED epitaxial wafer is etched through a chip technology to form a plurality of LED chips which are arranged at intervals through cutting channels, a part of a first sacrificial layer is exposed out of the cutting channels, then an etchant solution is adopted to dissolve the first sacrificial layer through the exposed cutting channels, lossless stripping of a sapphire substrate can be achieved efficiently at low cost, and the service life of the LED chip is prolonged. The sapphire substrate can be recycled repeatedly, the step of grinding and thinning can be omitted, the problems that the electric leakage rate is increased and the yield is low due to the fact that an epitaxial lamination layer is damaged by an existing grinding process, physical damage is generated on the side wall when LED core particles are cut through laser, and the output efficiency of light is affected are solved, and then the reliability and the yield of LED chips are improved.

This invention provides a method and apparatus for laser debonding, belonging to the field of semiconductor technology. The method includes the following steps: providing a temporary bonding body for a wafer, the temporary bonding body comprising a silicon carrier, an interposer, a carbon-rich thin film, a bonding layer, and a wafer stacked together; in a vacuum environment, irradiating the temporary bonding body with an infrared pulsed laser, causing interface peeling at the carbon-rich thin film, thus completing the laser debonding between the silicon carrier and the wafer. This invention uses a carbon-rich thin film as the laser release layer, reducing costs. It possesses broad-spectrum, high-efficiency absorption characteristics in the infrared laser band, enhancing laser scattering and light-trapping effects, and improving laser energy absorption efficiency. By performing laser debonding in a vacuum environment, impurities such as microparticles generated during interface peeling can be removed from the cavity, avoiding wafer contamination and interference with the laser path, thus improving the cleanliness, stability, and overall device yield of the debonding process.

The utility model relates to the technical field of hearing aids, in particular to a receiver of a hearing aid, which comprises a shell, a receiver, a mounting seat, a cable and a plurality of connecting pieces, a mounting cavity is arranged in the shell, the receiver, the mounting seat and the connecting pieces are all arranged in the mounting cavity, the mounting seat is used for fixing the connecting pieces, and the connecting pieces are positioned between the receiver and the mounting seat. Mounting grooves used for containing the connecting pieces are formed in the mounting base, the mounting grooves and the connecting pieces are in one-to-one correspondence, the connecting pieces are arranged in the corresponding mounting grooves, the head ends of the connecting pieces make contact with the connecting end of the receiver, the cable penetrates through the shell and makes contact with the tail ends of the connecting pieces, and the connecting pieces are arranged in the receiver so that the cable and the receiver can be connected in a transition mode. The welding spot failure risk during direct connection between the cable and the receiver is eliminated, and the assembly reject ratio is reduced; and the cost is reduced, the consumption of solder paste consumables is reduced, signals are optimized, and the contact impedance stability is improved.

The utility model relates to a packaging box structure of automobile skylight glass, which comprises a box body (1), a partition plate structure and a reinforcing structure are arranged in the box body (1), and the automobile skylight glass (4) is arranged on the partition plate structure; according to the packaging box structure of the automobile skylight glass, a plurality of sets of partition plate structures are arranged in a box body, and the automobile skylight glass is arranged on the partition plate structures; the multi-layer stacking of the automobile skylight glass in the box body can be realized, the internal space of the box body is fully utilized, and the storage quantity of the automobile skylight glass is effectively increased. According to the partition plate structure, the automobile skylight glass can be fully protected, meanwhile, packaging operation is easy and fast, and the working efficiency of packaging work is effectively improved. The device is provided with a reinforcing structure, so that the interior of the box body can be supported, the bearing capacity of the device can be effectively enhanced, and protection on the automobile skylight glass is enhanced.

This invention discloses a high weather-resistant, alkali-resistant, long-shelf-life cement-based tile adhesive and its preparation method. By weight, it comprises the following components: 32-39 parts silicate cement, 37-48 parts mineral composite aggregate, 2.0-4.5 parts redispersible latex powder, 0-2.0 parts silicone-acrylic modified latex powder, 0.2-0.35 parts cellulose ether, 0.2-0.5 parts plant-based water-retaining colloid, 1.5-3.5 parts mineral fiber, 0.5-1.5 parts nano-reinforcing powder, 0.5-1.2 parts siliceous tempering functional component, 3-7 parts activated zeolite powder, 1.5-3.0 parts modified bentonite, 0.2-0.5 parts calcium stearate, 0.4-0.8 parts calcium formate, 0.1-0.25 parts polycarboxylate superplasticizer, 0.15-0.35 parts silicone powder, and 0.1-0.2 parts powder defoamer. The beneficial effects are: the material has excellent bonding performance, anti-slip properties, and long open paving time, while also having the characteristics of strong resistance to alkali return, resistance to drying shrinkage and cracking, weather resistance and durability, the powder is not easy to absorb moisture and clump, and has a long shelf life; the preparation method is stable and compatible with conventional dry powder mortar production lines, and different compatible grades of products can be produced on the same line, with strong controllability in mass production.

The present invention relates to an etching liquid composition for silver-containing thin film, which comprises (A) nitric acid, (B) organic acid, (C) metal or metal salt, (D) sulfate, (E) chloride ion, and (F) water, the content of the (E) chloride ion being 0.01 to 5 ppm relative to the total weight of the etching liquid composition for silver-containing thin film, and an etching method using the same, which is excellent in preventing wiring loss and suppressing the precipitation of silver chloride and residue.

The invention discloses an SMT production line control method and system based on an Internet of Things chip, and relates to the technical field of SMT production line control of the Internet of Things chip, an initial requirement matrix is generated by extracting calculation requirements of each link, and an integrated calculation framework is obtained by integrating heterogeneous calculation frameworks of a multi-core processor and an accelerator module; generating a resource allocation scheme, determining a task dependency graph in combination with interaction data of chip mounter coordinate operation and temperature curve adjustment, processing the task dependency graph by using a graph neural network, and inserting a buffer queue to perform synchronous execution and optimize a task scheduling sequence; and obtaining execution feedback data generated in real-time operation based on the optimized task scheduling sequence, and dynamically adjusting a computing power distribution vector to realize cooperative control of the SMT production line control system. According to the invention, a continuously optimized cooperative control framework is realized, and computing resources can be dynamically allocated and multi-task efficient collaboration can be realized according to real-time requirements of process links.

The invention discloses an LED micro-display module and a manufacturing method thereof. A glass substrate, a first SOG glass layer, a blue light chip embedding layer, a second SOG glass layer, a green light chip embedding layer, a third SOG glass layer and a red light chip embedding layer of the LED micro-display module are sequentially arranged from bottom to top; the blue light chip array, the green light chip array and the red light chip array are embedded in the blue light chip embedding layer, the green light chip embedding layer and the red light chip embedding layer respectively, the blue light chip array, the green light chip array and the red light chip array are all composed of N rows and M columns of corresponding chips, and the three kinds of chips are overlapped in the vertical direction; n electrodes of the three chips respectively extend to the upper surface of the LED micro display module through corresponding N electrode metal columns; the P electrodes of the three chips are all connected to the P electrode metal column and extend to the upper surface of the LED micro display module through the P electrode metal column. According to the invention, each pixel point is directly manufactured through a chip process, a huge transfer process is avoided, and the pixel density can be improved through a mode of stacking red, green and blue chips.

The present application relates to a kind of wafer conveying mechanical arm clamps, semiconductor processing equipment and wafer conveying method, belong to the technical field of semiconductor conveying equipment, solve the wafer skew problem in the wafer conveying process of the conveying equipment of semiconductor manufacturing equipment in the prior art and the problem of subsequent process quality decline caused by wafer breakage.The present application discloses a kind of wafer conveying mechanical arm clamps, including single group or multiple sets of clamping jaw, the pick-up and placement of wafer are realized in the way of clamping by mechanical arm clamp;Clamping jaw includes fixed part and movable part;Movable part is connected with fixed part by guiding device and anti-falling device, guiding device is guided to the moving direction and trajectory of movable part, anti-falling device is used to prevent movable part from separating from fixed part after moving along guiding device.The present application realizes the self-adjustment of the wafer skew of transmission equipment mechanical hand clamping in semiconductor manufacturing equipment.

The invention discloses a knotless metal gauze. The knotless metal gauze comprises a plurality of micro-nano mesh holes and a plurality of micro-nano mesh lines, and the micro-nano meshes are arranged in a penetrating manner. The micro-nano network cables are metal wires, a plurality of metal wires are integrally crossed in a net-knot-free manner to form a grid shape, and the widths of the plurality of micro-nano network cables forming the same micro-nano mesh and / or different micro-nano meshes are different. The plurality of metal wires are integrally crossed in a net knot-free manner to form the knot-free metal gauze, so that the knot-free metal gauze does not need to be woven and formed, the inking property is ensured, the line width of the micro-nano net lines is controlled, and different line widths are set to ensure that the knot-free metal gauze has enough tensile strength, so that the processing difficulty is reduced, the yield is ensured, and the cost is reduced. In addition, the invention further discloses a screen printing plate with the knotless metal gauze.

The utility model belongs to the technical field of dental medical instruments, and relates to a key and dental handheld equipment. The key comprises a key body, a first movable ring and a first connecting arm, the key body is located in the first movable ring, the two ends of the first connecting arm are connected with the key body and the first movable ring respectively, the first movable ring is provided with at least two installation positions, the multiple installation positions are distributed on the two sides of the key body, and the installation positions are used for being connected with the inner side of the shell. The key body is used for being arranged corresponding to the through hole of the shell. According to the application, an effect of pressing deformation to trigger the switch is achieved through cooperation among the key body, the first movable ring and the first connecting arm without using a rubber coating process to wrap an elastic material on the surface of the shell and without setting a veneer on the surface of the shell, so that the process steps, the manual processing cost and the rework cost are reduced, and the production efficiency is improved. The quality and appearance reject ratio are reduced, and the size of the dental handheld equipment applying the dental handheld equipment is reduced.

This application provides a single-cell battery, an energy storage device, an energy storage system, and a power supply system. The single-cell battery includes a casing; a cell, including a cell body and a tab connected electrically; a restraining member, including a side plate, a bottom plate, and a guide plate, the side plate being disposed around the outer periphery of the bottom plate and the bottom plate and the side plate defining a mounting groove, the bottom plate having a through groove, the guide plate protruding from the surface of the bottom plate facing the mounting groove and disposed around the outer periphery of the through groove; a tab passing through the through groove and partially located within the mounting groove; and an end cap assembly disposed on the side of the restraining member away from the cell body, the end cap assembly including an adapter, the adapter being connected to the end of the tab away from the cell body; the dimension of the tab passing through the through groove is w1, the dimension of the guide plate along a first direction is w2, the distance from the connection point of the adapter and the tab closest to the cell body to the end face of the tab away from the cell body is w3, then 2≤(w1-w3) / w2≤8.

The utility model provides a material package material placing, code spraying and code scanning equipment, which comprises a mounting rack, a guide mechanism and a leveling mechanism, the guide mechanism is arranged in the mounting rack, the guide mechanism comprises a conveying belt, two baffles and a plurality of positioning carriers which are sequentially arranged side by side along the longitudinal direction, the two baffles are oppositely connected to two sides of the conveying belt along the transverse direction, and the leveling mechanism is arranged on the conveying belt. The positioning carrier is placed on the conveying belt and arranged between the two baffles in a matched mode, the positioning carrier is provided with a stop positioning part used for limiting movement of the material bag, a containing space is formed in the stop positioning part, the leveling mechanism is fixed to the mounting rack, and the leveling mechanism and the positioning carrier are arranged in a spaced mode in the vertical direction. Therefore, the material bag can be positioned through the guide mechanism and is prevented from deviating in the transportation process, so that the code spraying position is uniform, the reject ratio caused by lack of characters or unclear sprayed codes is reduced, and the two sides can be further prevented from tilting through the leveling mechanism, so that the clear sprayed codes and the production efficiency are better ensured.

The application discloses a DRAM aging test data analysis system and relates to the technical field of DRAM aging test; in order to quickly lock the possible failure reason; including a historical test database, a test data input module, a yield data judgment module, a Bin Map concentration analysis module, a Slot correlation analysis module, a BIB correlation analysis module, an OVEN correlation analysis module, a program Bin Gap analysis module, a program failure item analysis module, a failure model analysis module, a failure model input module, an analysis report and early warning module. The application establishes the corresponding connection through the correlation of the yield and the machine, automatically compares whether abnormal points appear in the test process in the production process, such as low yield, failure concentration, Bin Gap and continuous fail, so that abnormal data can be found in time, and the timeliness of data analysis is improved.

The utility model discloses an automatic blanking device of a TOPCon battery texturing machine. The automatic blanking device comprises a blanking table carrying mechanism, a detection device and a blanking device, the detection device comprises a conveying mechanism and a detection mechanism, the conveying mechanism comprises a rotating mechanism, a moving mechanism and a positioning mechanism, the rotating mechanism rotates the battery piece baskets at the discharging table carrying mechanism to be matched with the placing positions on the moving mechanism, and the positioning mechanism is used for positioning the battery piece baskets on the moving mechanism. According to the automatic blanking device, automatic blanking can be realized, various defects caused by the fact that conveying is not in place and a sensor cannot detect can be fundamentally solved through positioning above the battery piece flower basket, manual processing time is saved, and meanwhile productivity loss caused by the fact that the conveying speed is increased, no fixed shaking flower basket falls down and fragments fall down is reduced.

The invention provides block type polyimide resin as well as a preparation method and application thereof. A molecular main chain of the block type polyimide resin comprises hard segment units and soft segment units which are alternately distributed, the soft segment units contain more flexible groups and are low in glass-transition temperature, and the hard segment units contain more rigid conjugated groups and are high in glass-transition temperature. When the temperature rises and the soft segment unit is changed into a high-elastic state, the hard segment unit is still maintained in a glassy state, so that the block type polyimide resin can still maintain certain mechanical strength and enhance the processability while having better melting and bonding capacity. The block type polyimide resin is relatively good in thermal stability, mechanical property and dimensional stability, and has a very good application prospect.