Texture transferring female die, plate and preparation method thereof, shell and electronic equipment

A texture transfer, texture technology, applied in electrical equipment shell/cabinet/drawer, transfer printing, rotary printing machine and other directions, can solve problems to be improved, etc.

Active Publication Date: 2020-04-17
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current texture transfer master mold, plate and its pre

Method used

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  • Texture transferring female die, plate and preparation method thereof, shell and electronic equipment
  • Texture transferring female die, plate and preparation method thereof, shell and electronic equipment
  • Texture transferring female die, plate and preparation method thereof, shell and electronic equipment

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Embodiment Construction

[0026] Embodiments of the application are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary, and are intended to explain the present application, and should not be construed as limiting the present application.

[0027] In one aspect of the present application, the present application provides a texture transfer master. According to some examples of this application, refer to figure 1 and figure 2 ( figure 2 for along figure 1 Schematic diagram of the cross-sectional structure in the AA' direction in the center), the texture transfer master mold 100 has alternately spaced first texture regions 110 and second texture regions 120, and the texture transfer master mold 100 includes the first texture 10 and the second texture 20 , wherein the texture shapes of the first texture 10 and the second texture 20 are not completely the same, and the first texture 10 is ...

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PUM

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Abstract

The invention discloses a texture transferring female die, a plate and a preparation method thereof, a shell and electronic equipment, and particularly provides a texture transferring female die. A first texture area and a second texture area which are alternately arranged at an interval are arranged on the texture transferring female die. The texture transferring female die comprises a first texture and a second texture. The texture shapes of the first texture and the second texture are not completely identical, the first texture is located in the first texture area and part of the second texture area, and the second texture is located in the second texture area. The first texture and the second texture in the second texture area are arranged at an interval. Thus, a texture transferring sub-die formed by the texture transferring female die can form the effect that multiple kinds of textures are combined and overlaid through a one-time UV transferring process, a texture layer with a rich texture combined and overlaid effect can be easily and conveniently prepared through the texture transferring female die, the preparation process is simple, and the production cost can be reduced.

Description

technical field [0001] The present application relates to the field of plate processing, and in particular, relates to a texture transfer master mold, a plate and a preparation method thereof, a housing, and an electronic device. Background technique [0002] With the continuous development of preparation technology in the field of electronic products and the continuous improvement of consumption levels, consumers not only pursue the diversification of functions of electronic products, but also have higher and higher requirements for their appearance and texture. In addition to having a certain mechanical strength to protect the electronic equipment, the current electronic equipment casing also needs to be able to form a variety of colors, textures, gloss and other decorative effects to enrich the appearance of the electronic equipment and enhance the expressiveness of the product. [0003] However, the current texture transfer master mold, plate and its preparation method, ...

Claims

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Application Information

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IPC IPC(8): B41F16/00B44C3/02H05K5/02
CPCB41F16/00B44C3/02H05K5/0243
Inventor 董康
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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