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Integrated computer

A computer, all-in-one technology, applied in the computer field, can solve the problems of high local temperature, slow response speed, and reduced service life of the body.

Inactive Publication Date: 2022-01-21
ZHEJIANG INT MARITIME COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the internal circuits of the all-in-one computer are highly integrated, the problem of heat dissipation and dust removal is becoming more and more important. If the existing all-in-one computer only relies on its own heat dissipation mechanism, it is easy to cause local overheating, which will cause overtime in the long run. The service life of the body is greatly reduced, and the reaction speed will also slow down

Method used

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Embodiment Construction

[0024] Below in conjunction with accompanying drawing and embodiment the present invention is described in further detail:

[0025] The reference signs in the drawings of the description include: 1-computer main body, 2-base, 3-heat dissipation mechanism, 4-filter, 5-air inlet, 6-air outlet, 7-folding shell, 8-first fan Leaf, 9-second fan blade, 10-telescopic sleeve, 11-first rotating shaft, 12-second rotating shaft, 13-cooling box, 14-fan, 15-air supply pipe, 16-refrigerator, 17-connection Plate, 18-connection component, 19-supporting column, 20-sliding block, 21-clamping block, 22-T type clamping slot, 23-damping bearing, 24-extension plate, 25-limiting block, 26-th Three-axis, 27-guard.

[0026] Such as Figure 1-7 As shown, the present invention provides an all-in-one computer, comprising a computer main body 1, a base 2 and a heat dissipation mechanism 3, the back of the computer main body is provided with an air inlet 5 and an air outlet 6, and the air outlet 6 is loca...

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Abstract

An integrated computer disclosed by the present invention comprises a computer main body, a base and a heat dissipation mechanism, the heat dissipation mechanism comprises a folding shell, a first fan blade, a second fan blade and telescopic sleeves, the folding shell is fixedly connected with the computer main body, and the upper end opening and the lower end opening of the folding shell are respectively provided with two telescopic sleeves, the telescopic sleeves are arranged at the upper ends and the lower ends of the openings respectively, a plurality of first rotating shafts are connected between the telescopic sleeves located in the same opening, first fan blades are fixedly connected to the first rotating shafts, second fan blades are hinged to the first rotating shafts, the free ends of the first fan blades are connected with the first fan blades through the second rotating shafts, and sliding grooves allowing the second rotating shafts to move are further formed in the two ends of the first fan blades. A plurality of air holes are formed in the second fan blades, a cooling box is arranged in the folding shell, and the lower end of the back of the computer body is connected with the base. The device is simple in design, novel in structure and capable of rapidly reducing the local temperature of the machine body and flexibly changing the use angle and the installation position.

Description

technical field [0001] The invention relates to the field of computers, in particular to an all-in-one computer. Background technique [0002] The all-in-one computer refers to a new form of computer that integrates the host computer and the monitor. Its internal components are highly integrated. With the development of wireless technology, the keyboard, mouse and monitor can be connected wirelessly, which solves the problem of multiple cables on the desktop computer. As for the complicated problem, after the computer is connected to the Internet, you can watch any TV series, movies, current affairs news, etc., and it has gradually entered people's public life. However, because the internal circuits of the all-in-one computer are highly integrated, the problem of heat dissipation and dust removal is becoming more and more important. If the existing all-in-one computer only relies on its own heat dissipation mechanism, it is easy to cause local overheating, which will cause o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/18G06F1/20
CPCG06F1/1601G06F1/20G06F1/181
Inventor 周剑敏
Owner ZHEJIANG INT MARITIME COLLEGE
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