Supporting column, supporting disc and method for replacing supporting column

A technology of support columns and support plates, which is applied in the field of support columns, support plates and replacement support columns, can solve problems that are not conducive to the improvement of process quality, and achieve the effect of improving process quality

Pending Publication Date: 2022-04-08
PIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This is not conducive to the improv

Method used

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  • Supporting column, supporting disc and method for replacing supporting column
  • Supporting column, supporting disc and method for replacing supporting column
  • Supporting column, supporting disc and method for replacing supporting column

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Embodiment Construction

[0032] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are part of the present invention Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art to which the present invention belongs. As used herein, "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other el...

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Abstract

The invention provides a supporting column for supporting a wafer. The supporting column comprises a column body and a resisting part, the resisting part extends to the outer side of the peripheral surface of the column body, so that when the supporting column is placed in a hole of a wafer supporting disc, the resisting part and the hole wall generate friction force, and the supporting column is stably accommodated in the hole. The invention further provides the supporting disc and a method for replacing the supporting column.

Description

technical field [0001] The invention relates to the technical field of semiconductor technology, in particular to a support column, a support plate and a method for replacing the support column. Background technique [0002] In the thin film deposition process involving plasma, the wafer is placed on the wafer support plate of the process chamber, so that the wafer is exposed to the reaction area distributed with the radio frequency electric field. The reactive gas is converted into plasma under the action of an electric field for thin film deposition on the wafer. The distribution range of the electric field can cover each component in the process chamber, so that the surface of each component accumulates a considerable amount of charge. For example, charge builds up on the wafer, creating an attractive electrostatic force with the support pad below the wafer. Although in some applications, the wafer support plate is designed to use electrostatic attraction to stabilize t...

Claims

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Application Information

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IPC IPC(8): H01L21/687C23C16/458
Inventor 郭月姜崴
Owner PIOTECH CO LTD
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