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Array type connection structure and electronic equipment

A connection structure and array-type technology, which is applied to the structural parts of electrical equipment, electrical components, digital processing power distribution, etc., can solve the problems of poor heat dissipation and achieve the effect of ensuring heat dissipation

Pending Publication Date: 2022-06-21
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present application provides an array connection structure and electronic equipment to solve the problem of poor heat dissipation. The technical solution is as follows:

Method used

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  • Array type connection structure and electronic equipment
  • Array type connection structure and electronic equipment
  • Array type connection structure and electronic equipment

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Embodiment Construction

[0042] The terms used in the embodiment part of the present application are only used to explain the embodiments of the present application, and are not intended to limit the present application.

[0043] In a data center, there are a large number of servers, and the servers are placed in cabinets. The server mainly includes a frame body and a variety of electronic devices. The frame body is used to provide an installation basis for the electronic devices. Each electronic device is installed in the frame, and each electronic device is electrically connected to each other as required to achieve its own functions, thereby Make up the server.

[0044] In the related art, an electronic device mainly includes a chip set and a plurality of hard disks arranged in an array. In order to arrange the arrangement of electronic devices, the chipset will not be directly electrically connected to each hard disk through cables, but a backplane is usually configured in the frame. The backplan...

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PUM

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Abstract

The invention discloses an array type connection structure and electronic equipment, and belongs to electronic devices. The array type connecting structure comprises a support and a plurality of connecting assemblies. The support is used for fixing a plurality of connecting assemblies which are sequentially arranged at intervals in the length direction of the support, and no signal wire is arranged in the support. Each connecting assembly penetrates through the bracket; the first side of each connecting assembly is provided with a connector interface, the connector interface comprises a plurality of first signal terminals, and the connector interface is used for being connected with a first electronic device located on the first side of the support; the second side of each connecting assembly is directly connected with a plurality of cables, the plurality of cables are in one-to-one correspondence with the plurality of second signal terminals of the connecting assemblies, and the cables are used for being connected with second electronic devices located on the second side of the support; the support is provided with a heat dissipation through hole, and at least part of the heat dissipation through hole is located between the two adjacent connecting assemblies. The array type connection structure provided by the embodiment of the invention can have a good heat dissipation effect.

Description

[0001] This application claims the priority of the Chinese patent application with the application number 202011492203.9 filed on December 17, 2020 and the title of the invention is "array connection structure and electronic device", the entire contents of which are incorporated into this application by reference. technical field [0002] The present application relates to the field of electronic devices, and in particular, to an array connection structure and electronic equipment. Background technique [0003] In a data center, there are a large number of servers, and the servers are placed in cabinets. The server mainly includes a frame body and a variety of electronic devices, each electronic device is installed in the frame body, and the electronic devices are electrically connected to each other as required to form a server. [0004] In the related art, an electronic device mainly includes a chip set and a plurality of hard disks arranged in an array. In order to regul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20736G06F1/185G06F1/183G06F1/20H05K7/1452H05K7/1487H05K7/20727H01R12/67H01R12/724H01R13/533
Inventor 彭志勇陈家勇孙宝亮余文唐银中
Owner HUAWEI TECH CO LTD
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