Circuit board and preparation method thereof

Abstract

The invention provides a preparation method of a circuit board, which comprises the following steps of: providing a substrate, and forming a through hole in the substrate; a groove is formed in the hole wall of the through hole; metalizing the through hole and the groove, so that the hole wall of the through hole is covered with a metal layer; performing circuit manufacturing on the substrate to form two first conductive circuit layers, wherein each first conductive circuit layer comprises a plurality of first conductive circuits; the metal layer covering the hole wall of the through hole is removed to form a first conducting wire, and the first conducting wire and the first conducting circuit which are connected are equal in cross section area. According to the invention, the sectional dimensions of all parts of the whole circuit formed by electrical connection in the circuit board are consistent, so that signal loss and noise can be reduced. The invention further provides a circuit board.

Description

technical field [0001] The present application relates to a circuit board and a preparation method thereof. Background technique [0002] With the trend of miniaturization of electronic devices, the circuit wiring of electronic devices will be denser, and the denser the circuit, the more complicated the circuit wiring will be. If all the circuits are placed on the same layer of circuit board, It is possible that the lines are too close to cause signal interference, so a multi-layer circuit board design is required. [0003] The conductive lines of each layer of the multi-layer circuit board are electrically connected through via holes. Vias include conductive holes and pads around the conductive holes, which makes the cross-sectional area of ​​the vias inconsistent; and the size of the vias is limited by drilling and electroplating processes, and the cross-sectional area is often much larger than the cross-section of the conductive lines of each layer. Therefore, the cross...

AI Technical Summary

Problems solved by technology

Vias include conductive holes and pads located around the conductive holes, which makes the cross-sectional area of ​​the vias inconsistent; and the size of the vias is limited by drilling and electroplating processes, and the cross-sectional area is often much larger than the cross-section of the conductive lines of each layer Area; As a result, the cross-sectional size of the entire circuit formed by the electrical connection in the circuit board is inconsistent, which will cause signal loss and noise during signal transmission

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