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Composite board and method for producing the same composite board

A composite board and synthetic resin technology, which is applied to composite boards such as automotive interiors. The field of manufacturing such composite boards can solve problems such as long time, labor-intensive, and expensive adhesives.

Inactive Publication Date: 2006-12-13
ARACO CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] But since the adhesive is relatively expensive, such known techniques generally increase the cost of manufacturing composite panels
In addition, forming composite panels is labor-intensive and time-consuming due to the relatively long time it takes for the adhesive to fully set

Method used

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  • Composite board and method for producing the same composite board
  • Composite board and method for producing the same composite board
  • Composite board and method for producing the same composite board

Examples

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Embodiment Construction

[0018] In one embodiment of the invention, a composite panel comprising first and second panel substrates is manufactured. For example, a through hole may first be formed in the second board substrate. Thereafter, the first and second board bases may overlap each other such that the through hole of the second board base is covered with a first surface of the first board base, thereby forming an overlapping portion between the first and second board bases. Next, a molding material may be fed into the through hole of the second plate base to form a connection stub in the through hole. The connection stub may be welded to the circumferential surface of the through hole and the first surface of the first board base. As a result, the first and second board bases are joined in overlapping portions, thereby making a composite board.

[0019] Alternatively, the connection stub may be welded to the first surface of the second board base surrounding the through hole at the same time a...

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Abstract

Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10).

Description

[0001] This application claims priority from Japanese Patent Application Serial No. 2002-029905, the contents of which are hereby incorporated by reference. technical field [0002] The present invention relates to composite panels and methods of making such composite panels. More particularly, the present invention relates to a composite panel, such as an automotive trim, comprising two substrates arranged to form an overlapping portion and connected to each other at the overlapping portion; and to a method of manufacturing such a composite panel. Background technique [0003] For example, a method for manufacturing a composite panel is disclosed in Japanese Laid-Open Patent Publication No. 11-208271, in which an automobile interior is taken as an example of a composite panel. In known art, an automobile interior includes first and second interior substrates made of synthetic resin. The first (lower) trim substrate includes an integrally formed protrusion or pin extending ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/70F16B5/04B60R13/02B29C45/14B29C65/60B29L7/00B29L31/58
CPCB29C65/605B29K2711/126B29C45/14467B29C65/601B29K2711/14B29C65/70B29C45/14344B29C66/8322B29C66/45B29L2031/3005B29C66/71B29C66/12822B29C66/12841Y10T428/24339Y10T403/477Y10T403/473Y10T403/47Y10T428/24322B29C66/73921B29K2023/12
Inventor 部田仁司永谷保近藤俊明内田雅彦铃木诚
Owner ARACO CORP
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