Voltage applying device, electron source manufacture device and method

A technology for applying devices and manufacturing devices, which is applied in the direction of electrode system manufacturing, discharge tube/lamp manufacturing, cold cathode manufacturing, etc., and can solve problems such as current increase

Inactive Publication Date: 2003-03-26
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the carbon film is deposited (activated), the current flowing between the pair of element electrodes increases.

Method used

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  • Voltage applying device, electron source manufacture device and method
  • Voltage applying device, electron source manufacture device and method
  • Voltage applying device, electron source manufacture device and method

Examples

Experimental program
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Embodiment 1

[0083] This embodiment is an example of a voltage application device for applying a voltage to a conductor of an electrode wiring provided on a substrate, for example, to measure a disconnection, a short circuit, and a resistance value. Figure 4 For explaining the implementation form of the voltage applying device of the present invention, Figure 5 Indicates the substrate to be measured.

[0084] Figure 4 and 5 Among them, 110 is a substrate, 111 is an electrode wiring provided on the substrate, 611 is a probe contacting with the electrode wiring 111 to apply a voltage, 120 is a bracket provided with a probe 611 and a voltage application device of a heating and cooling mechanism, 121 122 is a cable connecting the temperature control device 121 and the bracket 120 of the voltage application device, 125 is a support for supporting the substrate 110, and 126 is a power supply and a current control system. The driving mechanism used for measuring disconnection, short circuit...

Embodiment 2

[0090] Embodiment 2 adopts the manufacturing device of the embodiment of the present invention without electrostatic clamping, Figure 8 and Figure 11 shown with multiple Figure 9 and Figure 10 An electron source manufacturing example of a surface conduction type electron emission device is shown. exist Figure 8-11 Among them, 6 is an electron emission element, 10 is an electron source substrate, 2 and 3 are element electrodes, 4 is a conductive film, 29 is a carbon film, 5 is the gap between the carbon film 29, that is, the electron emission part, and G is the gap between the conductive film 4 , 30 is the lead wiring.

[0091] 6 and 7 are used to illustrate the embodiment of the manufacturing device of the present invention, and Fig. 6 is a sectional view showing the whole of the device, Figure 7 is an enlarged perspective view of a part of FIG. 6 . 10 is an electron source substrate, 11 is a support body, 12 is a vacuum container, 15 is a gas inlet, 16 is an exhau...

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Abstract

To enable manufacturing of electron source of excellent electron emission characteristics without damage of a board aiming at miniaturization, simplification of operability, and improvement of manufacturing speed, mass production, durability and conductivity performance of a probe. A holder 120 and a probe 611 are provided as a means for voltage impression connected to a conductor fitted on a substrate 110 and enabling impression of voltage on en electrode wiring formed on the substrate 110, as well as a positioning means tracking and adjusting the position of the probe 611 against position change of the electrode wiring. The positioning means tracks and adjusts the position of the probe 611 to the electrode wiring by thermal expansion of the holder 120.

Description

technical field [0001] The present invention relates to a voltage application device suitable for use in an electron source manufacturing device, an electron source manufacturing device, and an electron source manufacturing method. Background technique [0002] Heretofore, electron emission elements are roughly classified into two types, thermionic electron emission elements and cold cathode electron emission elements. There are electric field emission type, metal / insulating layer / metal type and surface conduction type electron emission element. [0003] The surface conduction type electron emission element is formed in a small-area thin film on a substrate, and utilizes the electron emission phenomenon generated by flowing an electric current parallel to the film surface. Among them are No. 2352255 and No. 8-171849. [0004] A surface conduction electron emission element is characterized by comprising a pair of opposing element electrodes on a substrate and a conductive f...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01J9/44H01J9/02H01J9/39
CPCH01J9/027H01J9/025
Inventor大木一弘鎌田重人木村明弘
OwnerCANON KK