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Photo-induced cation curable epoxy resin composition

An epoxy resin, photocation technology, applied in the direction of in-line phenolic epoxy resin adhesive, epoxy resin adhesive, optics, etc., can solve the problem of no disclosure of photocationic curing resin, and achieve the effect of improving the bonding strength

Inactive Publication Date: 2005-09-07
汉高知识产权及控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, this publication does not disclose at all a photocationically curable resin capable of obtaining sufficient adhesive strength for alkali glass bonding applications or metal bonding applications such as stainless steel.

Method used

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  • Photo-induced cation curable epoxy resin composition
  • Photo-induced cation curable epoxy resin composition
  • Photo-induced cation curable epoxy resin composition

Examples

Experimental program
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Effect test

Embodiment

[0046] The components shown in Table 1 were mixed to obtain a resin composition. In Examples and Comparative Examples, the bisphenol A type epoxy resin is RE-3105 manufactured by Nippon Kayaku (Co., Ltd.), and the alicyclic epoxy resin is two (3,4-epoxycyclohexyl) adipate ( Union Carbide UVR-6128) and γ-glycidoxypropyltrimethylsilane were used as the silane coupling agent.

[0047] As a photocation initiator, as a "fast curing initiator" in the table, the compound [tetrakis(pentafluorophenyl)boronic acid {methyl-4-phenyl(methyl-1- Ethyl)-4-phenyl}iodonium salt (tetrakis(pentafluorophenyl)borate-{methyl-4-phenyl(methyl-1-ethyl)-4-phenyl}iodoniumsalt)], as "slow curing initiator", use Mixture of formula (C-5) and formula (C-6) (Union Carbide CYRACURE(TM) Photoinitiator UVI-6990).

[0048] As silica, silica having a specific gravity of 2.635 and an average particle diameter of 1.5 μm was used.

[0049] As talc, talc having a specific gravity of 2.70 and an average particle dia...

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Abstract

A photo-induced cation curable epoxy resin composition which comprises (a) an epoxy resin component containing an alicyclic epoxy resin and an epoxy resin having an aromatic ring, (b) a photo-cationic initiator and (c) a filler selected from the group consisting of the oxides, hydroxides and carbonates containing a 2 group element of the long periodic table of elements. The composition can be used as an adhesive exhibiting high adhesiveness toward a glass, particular an alkaline glass, or a metal.

Description

technical field [0001] The present invention relates to photocurable resins, and more particularly, to epoxy resin compositions curable by cationic polymerization upon exposure to light. Background technique [0002] The photocation-curable epoxy resin composition, which is cured by cationic polymerization of epoxy resin by irradiation of light, especially light in the UV range, has the same cured properties as the thermosetting type, and has the same characteristics as radical UV curing. Compared with the free radical UV curing type, it is not hindered by oxygen and has a smaller shrinkage rate than the radical UV curing type. It is known to be used for liquid crystal display applications and DVD lamination applications. [0003] The resin composition contains a photocation initiator. Photocation initiators are usually expressed in the form of salts, when using A + B - When expressed, it is known that because of its anion B - Depending on the type of resin, the curing s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/68C08K3/22C08K3/34C09J163/00C09J163/02C09J163/04G03F7/038
CPCC09J163/00G03F7/038C08G59/68
Inventor 颜玉爱寺田和代陈纯福
Owner 汉高知识产权及控股有限公司
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