Dual gauge lead frame
a lead frame and dual-gauge technology, applied in the direction of solid-state device manufacturing, electric devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of design and manufacturing challenges, undesirable manufacturing techniques used to form the dual-gauge lead frame, and the use of extrusion can affect cost, accuracy, time, flexibility,
Inactive Publication Date: 2005-03-03
DELPHI TECH INC
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Benefits of technology
[0007] It is, therefore, an object of the present invention to provide an improved lead frame design and process for forming. It is a further object of the present invention to provide a dual gauge lead frame design and process for forming.
Problems solved by technology
This can create design and manufacturing challenges when it becomes necessary to places such miniature components in communication with these larger assemblies.
Although forming a lead frame with dual gauges can result in a beneficial configuration for assembly, often the manufacturing techniques utilized to form this dual gauge lead frame are undesirable from a cost / complexity standpoint.
Extrusion processes can be utilized to create a varied gauge lead frame, but cost, accuracy, time, and flexibility can all be negatively impacted by the use of extrusion.
Therefore, it often does not present itself as a viable manufacturing alternative.
Laminate structures can be utilized, but they too can create costly, complex, and time consuming manufacturing processes.
In addition, they can negatively impact the flexibility of the lead frame and therefore may not be suitable for some assemblies.
Method used
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[0017] Referring now to FIG. 1, which is an illustration of a plurality of lead frames 10 in accordance with the present invention. Although the plurality of lead frames 10 is illustrated in a grouping of five individual lead frames 12, it should be understood that the plurality of lead frames 10 may be comprised of any number of individual lead frames 12 or even a single lead frame 12. Grouping of lead frames 12 into a plurality 10 is a technique beneficial for efficient and cost effective mass production.
[0018] The lead frames 12 include a flat circuit surface 12. A wide variety of flat circuit surfaces 12 are known in the field and contemplated by the present invention. The flat circuit surfaces 12 include a plurality of mating surfaces 14 and a plurality of terminal arms 16. The plurality of mating surfaces 14 and the plurality of terminal arms 16 can be formed into the flat circuit surface 12 in a variety of fashions. One embodiment contemplates stamping the flat circuit surf...
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A dual gauge lead frame 36 is provided, including at least one mating surface 14 and a plurality of terminal arms 16 formed into a flat circuit surface 12 having a first gauge 32. Each of the plurality of terminal arms 16 includes a fold over terminal arm portion 28 folded over and coined into a base terminal arm portion 26 to form a plurality of end posts 30. The plurality of end posts 30 form a second gauge 34.
Description
TECHNICAL FIELD [0001] The present invention relates generally to a dual gauge lead frame for use in an electronics assembly. More specifically, the present invention relates a dual gauge lead frame with improved manufacturing characteristics. BACKGROUND OF THE INVENTION [0002] Electronic components have played an increasingly diverse role in modern product design and manufacturing. Design criteria has often lead to the miniaturization of many electronic components. Although the miniaturization of some components, such as chips, transistors, processors, etc., has proven highly successful, they must often be assembled in conjunction with circuits and assemblies of comparatively larger dimensions. This can create design and manufacturing challenges when it becomes necessary to places such miniature components in communication with these larger assemblies. [0003] One solution to such scenarios has been through the use of lead frames. Lead frames provide an electrical conduit from the m...
Claims
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Login to View More IPC IPC(8): H01L21/48H01L23/495
CPCH01L21/4842H01L24/97H01L23/49548H01L2924/12042H01L2924/00
Inventor DAVIS, PATRICK A.
Owner DELPHI TECH INC