System for attaching semiconductor components to substrates
a technology of semiconductor components and substrates, applied in the field of semiconductor component assembly, can solve the problems of highhampered mechanisms, and disadvantages of dicing tape, and achieve the effect of reducing the cost of manufacturing, and improving the adhesion of dicing tap
Inactive Publication Date: 2006-06-22
KOOPMANS MICHEL
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AI Technical Summary
Benefits of technology
This approach ensures efficient and controlled separation of components from the dicing tape, reducing damage and handling issues while maintaining adhesion for non-selected components, thereby improving the overall attachment process.
Problems solved by technology
However, the high adhesion of the dicing tape is a disadvantage when the singulated components must be removed from the tape.
These mechanisms are hampered by the high adhesion of the dicing tape, which must be overcome to separate the singulated components from the tape.
However, if all of the dicing tape has been exposed to radiation, the non-premium components remaining on the tape may not be secured for further transport.
This movement and separation can chip and damage the dice and cause problems in handling and in subsequent processing steps.
Method used
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Embodiment Construction
[0030] As used herein the term “semiconductor component” refers to an element that includes one or more semiconductor dice. Exemplary semiconductor components include bare semiconductor dice, bumped semiconductor dice, semiconductor packages, and chip scale packages.
[0031] The term “substrate” refers to an element configured to support one or more semiconductor components. Exemplary substrates includes metal leadframes, organic leadframes, ceramic or silicon plates, glass resin panels, and printed circuit boards.
[0032] The term “component substrate” refers to an element that includes a plurality of semiconductor components. Exemplary component substrates include semiconductor wafers containing dice or packages, portions of semiconductor wafers, and panels containing semiconductor packages.
[0033] The term “tape” refers to an element that includes a polymer substrate and at least one adhesive surface. Exemplary tapes include a polymer film such as polyethylene, polypropylene, polye...
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Abstract
A method and a system for attaching semiconductor components to a substrate are provided. In the illustrative embodiment the substrate is a leadframe, and the components are semiconductor dice or packages contained on a component substrate such as a wafer. The method includes the steps of holding and dicing the component substrate using a radiation sensitive tape. The method also includes the steps of providing a component attach system having a radiation curing system, and then performing local curing of the dicing tape during a component attach step using the component attach system. The system includes the component attach system which includes a stepper mechanism for stepping the component substrate, and a component attach mechanism having an ejector pin for pushing the components one at a time from the tape and a pick and place mechanism for placing the components on the substrate. The component attach mechanism also includes a housing having a contact surface for physically engaging the dicing tape, and an opening having an outline matching that of a singulated component.
Description
CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation of Ser. No. 10 / 157,723 filed May 28, 2002, which is a division of Ser. No. 09 / 906,324 filed Jul. 16, 2001, U.S. Pat. No. 6,589,809 B1. [0002] This application is related to Ser. No. 10 / 456,274 filed Jun. 6, 2003, U.S. Pat. No. 6,943,094 B2.FIELD OF THE INVENTION [0003] This invention relates generally to semiconductor manufacture, and more particularly to a method and system for attaching semiconductor components, such as dice and packages, to a substrate, such as a leadframe or panel, in which a dicing tape for the dice is locally cured using radiation. BACKGROUND OF THE INVENTION [0004] One well known semiconductor processing step involves dicing a semiconductor wafer into singulated components. Typically the wafer includes a plurality of semiconductor dice or semiconductor packages, which are referred to herein as “semiconductor components”. [0005] One technique for dicing a wafer is saw cutting. Wi...
Claims
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IPC IPC(8): B27G11/02H01L21/00
CPCH01L21/67121H01L21/67132H01L21/6836H01L2221/68322H01L2221/68327
InventorKOOPMANS, MICHEL
OwnerKOOPMANS MICHEL