Modular Probe System
a module-type, probe-based technology, applied in the direction of electrical testing, measurement devices, instruments, etc., can solve the problems of prohibitively high cost of two probe systems, inability to adapt to the size and size of conventional probe systems, and inability to meet the requirements of measurement and measuremen
Inactive Publication Date: 2010-11-04
SEMIPROBE
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Benefits of technology
"The present invention is a modular test system for testing a device-under-test (DUT). The system includes a mounting interface, a plurality of components removably positionable on the mounting interface, and a plurality of quick-release connectors for securing the components together or to the mounting interface. The components include at least one probe, which can be easily replaced with another probe or a different chuck in less than 60 minutes with only hand tools. The system also includes a method for testing a DUT by releasably securing a first plurality of components to the mounting interface and then removing some of them to releasably secure a second plurality of components to the mounting interface. The technical effects of the invention include improved efficiency and flexibility in testing DUTs, as well as simplified and streamlined procedures for replacing components."
Problems solved by technology
Purchasing capital equipment is believed to be the second largest expense associated with operating a semiconductor facility.
Conventional probe systems typically offer no flexibility or upgradeability in terms of size, materials that can be probed and other capabilities.
Particularly for smaller businesses, academic institutions and other organizations with limited capital equipment budgets, the cost of two probe systems can be prohibitively expensive.
Moreover, new probe systems are often not immediately available, with delivery times of 8-12 weeks being typical.
To complicate matters, strong disincentives are believed to exist in the probing industry to deviate from the use of probe systems that are dedicated to a given test, and are not easy to upgrade or otherwise change.
Method used
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[0014]Referring now to the drawings, FIGS. 1 and 2 illustrate an example of a modular probe system 100 made in accordance with concepts of the present invention. System 100 is configured to test a device-under-test (DUT) 103, e.g., diced or undiced semiconductor chips in a semiconductor wafer, packaged parts, substrates, printed circuit boards, microscope slides, and optics and optical components, among others. System 100 is denoted as being “modular” because it is made up of several components 106 releasably secured to a base 108. Some or all of components 106 may be quickly and easily replaced with other components or freely moved around to other locations. As a result, modular probe system 100 provides a single platform that can be used to perform different analysis and / or apply different testing protocols on DUTs from substantially different scientific fields. For example, system 100 can be first configured to probe a semiconductor wafer and provide data regarding its performanc...
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A modular probe system that includes components that are selected to test different devices-under-test (DUTs) in a number of different scientific fields. The system includes quick-release connectors that may be used to releasably secure components of the modular probe system to one another or to a mounting interface. These connectors permit quick and easy attachment and detachment of various components in a manner that permits a user to readily configure the probe system for each DUT.
Description
RELATED APPLICATION DATA[0001]This application is a divisional of application Ser. No. 12 / 023,787, filed Jan. 31, 2008, and titled “Modular Probe System,” which application claims the benefit of priority of U.S. Provisional Patent Application Ser. No. 60 / 887,426, filed Jan. 31, 2007, and titled “Modular Probe System and Method,” which are incorporated by reference herein in their entireties.FIELD OF THE INVENTION[0002]The present invention generally relates to the field of test devices. In particular, the present invention is directed to a modular probe system.BACKGROUND[0003]Probe systems are used to analyze, examine, and test devices in many industries, such as the semiconductor and material science industries. Probe systems are capital equipment that may range in price from $15,000 to over $1,000,000. Purchasing capital equipment is believed to be the second largest expense associated with operating a semiconductor facility. Conventional probe systems typically offer no flexibili...
Claims
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IPC IPC(8): G01R31/00
CPCG01R31/31907G01R31/2889
InventorDAOUDI, MOSTAFAFEUERSTEIN, DONPLACE, DENIS
OwnerSEMIPROBE