Connecting structure and adhesion method of PCB using anisotropic conductive film, and method for evaluating connecting condition using the same

a technology of anisotropic conductive film and connecting structure, which is applied in the direction of conductive layers on insulating supports, printed circuit aspects, insulating bodies, etc., can solve the problems of limiting the inspection of a restricted portion of samples, affecting the quality of the sample, so as to achieve the effect of easy evaluation of the connection sta

Inactive Publication Date: 2011-12-01
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011]The present invention is designed to solve the above-mentioned problems, and therefore it is an object of the present invention to provide a connecting structure of PCB using an anisotropic conductive film, which can easily evaluate a connection state of members having electrodes of fine pitch without a separate inspection step.Technical Solution

Problems solved by technology

However, electrodes of the driver IC and electrodes of the LCD panel are arranged at fine pitches, and thus any mounting method has a difficulty in using a means such as soldering.
However, this method requires a separate inspection step, thereby delaying a process, and has a limitation of inspecting only a restricted portion of a sample.
And, because at least one substrate should have a transparent property to observe the pressed state of the conductive particles, the method has a limitation in wide application.

Method used

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  • Connecting structure and adhesion method of PCB using anisotropic conductive film, and method for evaluating connecting condition using the same
  • Connecting structure and adhesion method of PCB using anisotropic conductive film, and method for evaluating connecting condition using the same
  • Connecting structure and adhesion method of PCB using anisotropic conductive film, and method for evaluating connecting condition using the same

Examples

Experimental program
Comparison scheme
Effect test

experimental example 1

[0048]After the anisotropic conductive film made of an epoxy resin is attached to the PCB having the width of the electrode of 200 μm, the interval between the adjacent electrodes of 150 μm, and the pitch between the electrodes of 350 μm, pressure of 1.5 MPa is applied at 80° C. during 2 seconds for temporary compression. Then, after the cover film of the anisotropic conductive film is removed, the FPC is arranged such that the electrodes of the PCB are aligned with the electrodes of the FPC. Next, pressure of 3 MPa is applied at 180° C. during 20 seconds for substantial compression. Subsequently, the surface roughness value of one surface of the FPC is measured using the surface roughness tester, and the contact resistance between the electrodes of the PCB and the FPC is measured.

experimental example 2

[0049]After the anisotropic conductive film made of an acryl resin is attached to the PCB having the width of the electrode of 200 μm, the interval between the adjacent electrodes of 150 μm, and the pitch between the electrodes of 350 μm, pressure of 1.5 MPa is applied at 80° C. during 2 seconds for temporary compression. Then, after the cover film of the anisotropic conductive film is removed, the FPC is arranged such that the electrodes of the PCB are aligned with the electrodes of the FPC. Next, pressure of 3 MPa is applied at 180° C. during 10 seconds for substantial compression. Subsequently, the surface roughness value of one surface of the FPC is measured using the surface roughness tester, and the contact resistance between the electrodes of the PCB and the FPC is measured.

experimental example 3

[0050]After the anisotropic conductive film made of an epoxy resin is attached to the PCB having the width of the electrode of 230 μm, the interval between the adjacent electrodes of 220 μm, and the pitch between the electrodes of 450 μm, pressure of 1.5 MPa is applied at 80° C. during 2 seconds for temporary compression. Then, after the cover film of the anisotropic conductive film is removed, the FPC is arranged such that the electrodes of the PCB are aligned with the electrodes of the FPC. Next, pressure of 3 MPa is applied at 180° C. during 20 seconds for substantial compression. Subsequently, the surface roughness value of one surface of the FPC is measured using the surface roughness tester, and the contact resistance between the electrodes of the PCB and the FPC is measured.

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Abstract

A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.

Description

TECHNICAL FIELD[0001]The present invention relates to a connecting structure of PCB (Printed Circuit Board) using an anisotropic conductive film (ACF), and in particular, to a connecting structure of PCB using an anisotropic conductive film, which can easily check a connection state between electrodes of members when adhering to the members.BACKGROUND ART[0002]Generally, an ACF is a connecting material applied to the case that members cannot be connected to each other by a soldering method as the members are made of special materials or have fine pitch signal wirings.[0003]The ACF is typically used to package LCD panels, printed circuit boards (PCBs), driver IC circuits and so on in LCD modules.[0004]For example, an LCD module has a plurality of driver ICs mounted thereon for driving thin film transistor (TFT) patterns. A method for mounting a driver IC on an LCD module mainly includes a chip on glass (COG) mounting method for mounting a driver IC on a gate area and a data area of a...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H05K1/00
CPCH05K3/323H05K3/361H05K2201/091H05K2203/0278Y10T29/49131Y10T29/49124Y10T29/41Y10T29/49117Y10T29/4913Y10T29/49144C09J9/02H01B5/14H01B17/62H01R4/04
InventorHAN, CHUL-JONGCHUNG, YOON-JAEJANG, JONG-YOONPARK, JEONG-BEOMHAN, YONG-SEOKCHOI, SUNG-UKCHO, IL-RAEMOON, HYUK-SOOLEE, KYUNG-JOON
OwnerLG INNOTEK CO LTD