Heat pipe structure

a technology of heat pipe and heat exchanger, which is applied in the direction of indirect heat exchangers, lighting and heating apparatus, etc., can solve the problems of poor heat exchange efficiency, limited heat exchange efficiency of conventional heat pipes, and deterioration of heat exchange efficiency, so as to achieve the effect of greatly enhancing heat exchange efficiency

Inactive Publication Date: 2013-05-23
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an improved heat pipe structure that has better heat transfer performance and is able to achieve excellent heat dissipation effect. The heat pipe structure has two separate chambers for the vapor-phase and liquid-phase working fluids to transfer heat, which greatly enhances heat transfer efficiency.

Problems solved by technology

The conventional heat pipe generally has one single chamber and one single capillary structure so that the heat transfer efficiency of the conventional heat pipe is limited.
The backflow of the liquid will obstruct the vapor from smoothly flowing to deteriorate the heat transfer efficiency.
1. The heat transfer efficiency is poor.
2. The vapor-liquid circulation efficiency of the working fluid is poor.

Method used

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Embodiment Construction

[0029]Please refer to FIGS. 1, 2A and 2B. FIG. 1 is a longitudinal sectional view of a first embodiment of the heat pipe structure of the present invention. FIG. 2A is a cross-sectional view of the first embodiment of the heat pipe structure of the present invention. FIG. 2B is an enlarged view of circled area A of FIG. 2A. According to the first embodiment, the heat pipe structure of the present invention includes a first tubular body 10, a second tubular body 20 and a first capillary structure 202.

[0030]The first tubular body 10 has a first chamber 101 and a working fluid 2.

[0031]The second tubular body 20 is disposed in the first chamber 101 and has a second chamber 201.

[0032]The first capillary structure 202 is disposed on outer circumference of the second tubular body 20. The first capillary structure 202 is selected from a group consisting of a sintered powder body, a structure formed with multiple channels, a mesh body and a coating. In this embodiment, the first capillary st...

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Abstract

A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first chamber and a working fluid. A first capillary structure is disposed on outer circumference of the second tubular body. The second tubular body is disposed in the first chamber and has a second chamber. In the heat pipe structure, the vapor-phase working fluid flows within the first chamber, while the liquid-phase working fluid flows within the second chamber in separation from the vapor-phase working fluid. Accordingly, the impedance against the vapor is greatly reduced and the heat transfer efficiency is greatly enhanced to achieve excellent heat dissipation effect.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to a heat pipe structure, and more particularly to an improved heat pipe structure having multiple chambers, whereby the vapor-phase working fluid and the liquid-phase working fluid independently separately flow within different chambers to transfer heat. Accordingly, the heat transfer effect is greatly enhanced to achieve better heat dissipation effect.[0003]2. Description of the Related Art[0004]Following the continuous development of scientific and technical industries, the operation speed and performance of all kinds of electronic components have been continuously enhanced. In the meantime, the waste heat generated by the electronic products has become higher and higher. In the conventional heat dissipation devices, heat pipe is a simple but very effective heat dissipation means. The heat pipe can quickly transfer a large amount of heat via latent heat. The heat pipe has the a...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): F28D15/04
CPCF28D15/046
InventorCHEN, CHIH-PENG
OwnerASIA VITAL COMPONENTS SHENZHEN CO LTD