Printed circuit board and method of fabricating an element

a printed circuit board and element technology, applied in the direction of printed circuit manufacturing, printed circuit aspects, printed circuit non-printed electric components association, etc., can solve the problem that the elements and chips of the printed circuit board fabricated by a non-plating process can easily become damaged

Inactive Publication Date: 2018-03-22
SILICON MOTION INC (TW)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This design effectively decreases the risk of electrostatic discharge on printed circuit boards during the wiring process, enhancing the stability and reliability of the chip structure and reducing manufacturing costs by minimizing damage to the circuit board elements.

Problems solved by technology

Therefore, the elements and chips of the printed circuit board fabricated by a non-plating process can easily become damaged during the wiring process of the Multi Stacked-Die Packaging due to electrostatic discharge (ESD).

Method used

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  • Printed circuit board and method of fabricating an element
  • Printed circuit board and method of fabricating an element
  • Printed circuit board and method of fabricating an element

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Embodiment Construction

[0016]The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.

[0017]FIG. 1 is a schematic diagram illustrating a printed circuit board in accordance with an embodiment. The printed circuit board 100 is divided into a plurality of package units 140, wherein each of the package units 140 is arranged to carry a plurality of dies, and each of the package units 140 is arranged to be packaged into an element, such as a processor, a sensor, etc. More specifically, the printed circuit board 100 is cut along the dash lines as shown in FIG. 1 after the printed circuit board 100 is processed by the wire bonding process and the molding process of packaging, such that the printed circuit board is cut into a plurality of package units 140, whe...

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PUM

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Abstract

The present invention provides a printed circuit board fabricated by a Non-Plating Process that includes at least one plating bar disposed around at least one package unit of the printed circuit board. The package unit includes at least one ground line, at least one power line and a plurality of signal lines. The ground line has a first contact pad exposed on a surface of the printed circuit board, and at least one of the ground lines is connected to the plating bar. The power line has a second contact pad exposed on the surface, and at least one of the power lines is connected to the neighboring plating bar. The signal line has a third contact pad exposed on the surface.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This Application is a Continuation application of pending U.S. application Ser. No. 15 / 435,398, filed on Feb. 17, 2017, which claims priority of Taiwan Patent Application No. 105108416, filed on Mar. 18, 2016, the entirety of which are incorporated by reference herein.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention is related to a printed circuit board, and in particular to a printed circuit board manufactured by a non-plating process.Description of the Related Art[0003]The integrated circuit industry mainly comprises IC (Integrated Circuit) design, IC manufacturing, and chip test, wherein the current chip packaging technologies include Ball Grid Array (BGA), Chip-Size Package (CSP), Wafer Level Package (WLP), Three Dimension Package (3D package) and System in a Package (SIP). It is important for the stability of the IC that the chip structure directly affects the electric ability, mechanical ability, thermal ...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L23/498H01L23/00H01L23/31H01L21/48H01L21/56H01L21/78
CPCH01L24/97H01L21/561H01L21/565H01L21/4846H01L23/3114H01L23/49805H01L23/49838H01L21/78H01L23/48H05K1/18H05K3/00H05K2203/1316H05K3/0097H05K3/242H05K2201/09681H05K2203/072H05K2203/0723
InventorHUANG, SHU-YINGCHEN, TE-WEICHEN, HSIU-YUAN
OwnerSILICON MOTION INC (TW)