Light emitting diode device and packaging method therefore
A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as increased manufacturing costs, increased manufacturing complexity of LED light-emitting devices, and increased volume of LED light-emitting devices, and achieves the effect of simplifying the manufacturing process
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2010-08-11
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The present invention relates to a light emitting diode (light emitting diode, LED) device and its packaging method, especially to a light emitting diode device that can be used as a double-sided white light emitting device and its packaging method. Background technique
[0002] Compared with traditional light sources such as cold cathode tubes, LED packaging components have small size, low power consumption, high brightness, high color performance, fast response (can be operated at high frequency), environmental protection (shock resistance, impact resistance and not easy to break) , recyclable) and easy to develop into light, thin and short products and other advantages, so LED light source has a certain market advantage. Generally speaking, a traditional LED packaging assembly basically includes a packaging cup and an LED chip mounted on the packaging cup. The traditional packaging cup holder has two internal connection terminals and two external c...
Examples
Embodiment Construction
[0028] Please refer to Figure 1 to Figure 3 . figure 1 It is a structural schematic diagram of the LED device 100 of the first preferred embodiment of the present invention, figure 2 for figure 1 The schematic top view of the first transparent substrate 124 shown, and image 3 for figure 1 The three-dimensional exploded schematic diagram of the LED chip 128 and the first transparent substrate 124 is shown. Such as figure 1 As shown, the LED device 100 may include a first transparent substrate 124 , a plurality of LED chips 128 fixed on the first transparent substrate 124 , and a transparent glue 130 covering the LED chips 128 . Wherein, the first transparent substrate 124 may include any transparent material, such as a glass substrate or a plastic substrate. The LED chips 128 can be various types of LED chips. In a preferred situation, the upper and lower surfaces of each LED chip 128 used can emit light uniformly. For example, the wavelength range of the emitted light...