Electronickelling alloy solution for improving corrosion resistance of coating

Abstract

The invention discloses an electronickelling solution for improving the corrosion resistance of a coating. The electronickelling solution comprises nickel salt, phosphorous acid, boric acid, organic carboxylic acid or salts thereof, and hydroxycarboxylic acid of unsaturated hydrocarbon. The electronickelling solution has good stability, no self decomposition and excellent corrosion resistance. The electronickelling solution solves the problem of poor dispersibility of a nickel-phosphorus alloy coating (namely the problem of skip plating in a region with low current density) in the prior art. Compared with a common nickel coating with the same thickness, no matter whether chromium is plated on the coating obtained by an optimal formula of the plating solution or not, the salt fog test time is prolonged by 3 times.

Description

technical field

[0001] The invention relates to a high-performance electroplating nickel solution, in particular to an electroplating nickel alloy solution for improving the corrosion resistance of the coating. Background technique

[0002] The metal nickel coating that people are familiar with and often used can generally be used as an intermediate coating (the outer layer is mostly chromium coating) or a surface coating on a copper or copper-iron substrate to improve the protection and decoration of the base metal. As we all know, the nickel coating is a cathodic coating on the copper-iron substrate, which can only play a mechanical protective role. The nickel plating layer is porous, and the corrosion resistance of the nickel plating layer is general, and the plating layer is prone to yellowing and discoloration when exposed to outdoors for a long time. It is usually plated with a layer of chromium to improve its protection and corrosion resistance. The nickel-phosphoru...

Examples

Embodiment 1

[0034] A kind of electroplating nickel solution that the present invention improves coating corrosion resistance, consists of

[0035] Nickel sulfate 250g / L

[0036] Phosphorous acid 35g / L

[0037] Boric acid 30g / L

[0038] Tartaric acid 100g / L

[0039] Hydroxymethacrylic acid 5g / L

[0040] PH: 2.0-2.5

[0041] Temperature: 60-65℃

[0042] Current: 2A

[0043] Time: 10 minutes

[0044] Preparation method: Take by weighing 250g of nickel sulfate, 35g of phosphorous acid, 30g of boric acid, 100g of tartaric acid, 5g of hydroxymethylacrylic acid, dissolve in water, adjust the pH to 2.5, and settle to 1000ml to obtain the electroplating nickel solution of the present invention.

[0045] The 10.2cm×6cm×0.05cm iron sheet is degreased and cleaned in hot lye, washed with water, corroded in dilute sulfuric acid, washed with water, and then subjected to the following 250ml Hull cell test, the results are as follows figure 1 Shown: In the low current area, the entire chip is full...

Embodiment 2

[0047] Comparative Test

[0048] Nickel sulfate: 250g / L

[0049] Phosphorous acid: 35g / L

[0050] Boric acid: 30g / L

[0051] PH: 2.0-2.5

[0052] Temperature: 60-65°C

[0053] Current: 2A

[0054] Time: 10 minutes

[0055] The results of the Hull cell test strips are as follows: figure 2 Shown: In the low current area, there is no coating in the 0.5cm area, that is, there is missing plating in the low current density area.

Embodiment 3

[0057] Nickel amino acid 250g / L

[0058] Phosphorous acid 35g / L

[0059] Boric acid 30g / L

[0060] Tartaric acid 100g / L

[0061] Hydroxymethacrylic acid 5g / L

[0062] PH: 2.0-2.5

[0063] Current: 2A

[0064] Time: 10 minutes

[0065] Preparation method: take by weighing 250g of nickel aminoglobulinate, 35g of phosphorous acid, 30g of boric acid, 100g of tartaric acid, 5g / L of hydroxymethacrylic acid, dissolve in water, adjust the pH to 2.5, and set the volume to 1000ml to obtain the present invention. Electroplating nickel solution.

[0066] The 10.2cm×6cm×0.05cm iron sheet is degreased and cleaned in hot lye, washed with water, corroded in dilute sulfuric acid, washed with water, and then subjected to the following 250ml Hull cell test, the results are as follows image 3 Shown: In the low current area, the entire chip is fully brightly plated without missing plating.

[0067] Thus it can be concluded that the plating solution of the present invention has solved the ...

technical field

[0001] The invention relates to a high-performance electroplating nickel solution, in particular to an electroplating nickel alloy solution for improving the corrosion resistance of the coating. Background technique

[0002] The metal nickel coating that people are familiar with and often used can generally be used as an intermediate coating (the outer layer is mostly chromium coating) or a surface coating on a copper or copper-iron substrate to improve the protection and decoration of the base metal. As we all know, the nickel coating is a cathodic coating on the copper-iron substrate, which can only play a mechanical protective role. The nickel plating layer is porous, and the corrosion resistance of the nickel plating layer is general, and the plating layer is prone to yellowing and discoloration when exposed to outdoors for a long time. It is usually plated with a layer of chromium to improve its protection and corrosion resistance. The nickel-phosphoru...

Examples

Embodiment 1

[0034] A kind of electroplating nickel solution that the present invention improves coating corrosion resistance, consists of

[0035] Nickel sulfate 250g / L

[0036] Phosphorous acid 35g / L

[0037] Boric acid 30g / L

[0038] Tartaric acid 100g / L

[0039] Hydroxymethacrylic acid 5g / L

[0040] PH: 2.0-2.5

[0041] Temperature: 60-65℃

[0042] Current: 2A

[0043] Time: 10 minutes

[0044] Preparation method: Take by weighing 250g of nickel sulfate, 35g of phosphorous acid, 30g of boric acid, 100g of tartaric acid, 5g of hydroxymethylacrylic acid, dissolve in water, adjust the pH to 2.5, and settle to 1000ml to obtain the electroplating nickel solution of the present invention.

[0045] The 10.2cm×6cm×0.05cm iron sheet is degreased and cleaned in hot lye, washed with water, corroded in dilute sulfuric acid, washed with water, and then subjected to the following 250ml Hull cell test, the results are as follows figure 1 Shown: In the low current area, the entire chip is full...

Embodiment 2

[0047] Comparative Test

[0048] Nickel sulfate: 250g / L

[0049] Phosphorous acid: 35g / L

[0050] Boric acid: 30g / L

[0051] PH: 2.0-2.5

[0052] Temperature: 60-65°C

[0053] Current: 2A

[0054] Time: 10 minutes

[0055] The results of the Hull cell test strips are as follows: figure 2 Shown: In the low current area, there is no coating in the 0.5cm area, that is, there is missing plating in the low current density area.

Embodiment 3

[0057] Nickel amino acid 250g / L

[0058] Phosphorous acid 35g / L

[0059] Boric acid 30g / L

[0060] Tartaric acid 100g / L

[0061] Hydroxymethacrylic acid 5g / L

[0062] PH: 2.0-2.5

[0063] Current: 2A

[0064] Time: 10 minutes

[0065] Preparation method: take by weighing 250g of nickel aminoglobulinate, 35g of phosphorous acid, 30g of boric acid, 100g of tartaric acid, 5g / L of hydroxymethacrylic acid, dissolve in water, adjust the pH to 2.5, and set the volume to 1000ml to obtain the present invention. Electroplating nickel solution.

[0066] The 10.2cm×6cm×0.05cm iron sheet is degreased and cleaned in hot lye, washed with water, corroded in dilute sulfuric acid, washed with water, and then subjected to the following 250ml Hull cell test, the results are as follows image 3 Shown: In the low current area, the entire chip is fully brightly plated without missing plating.

[0067] Thus it can be concluded that the plating solution of the present invention has solved the ...

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