Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

4results about How to "Same temperature" patented technology

Heat transfer printing system

The utility model relates to the technical field of heat transfer printing, and discloses a heat transfer printing system which comprises a heat transfer printing machine, a driving unit and a sealing plate. The driving unit is connected to the heat transfer printing machine; the sealing plate is connected with the driving unit; a feeding hole is formed in one side of the heat transfer printing machine; the sealing plate is in sliding connection with the heat transfer printing machine; a placing table is arranged on one side, close to the feeding hole, of the sealing plate; a supporting module is arranged on the placing table; the supporting module is used for supporting two ends of the workpiece and separating the workpiece from the surface of the placing table; the driving unit is used for driving the sealing plate to be close to or away from the feeding port. The heat transfer printing system can improve the heat transfer printing quality.
Owner:ROYAL GARDEN FOGANG FURNITURE MFG CO LTD

An isothermal die forging process and equipment for pistons used in ultra-high power-to-weight ratio unmanned aerial vehicles (UAVs).

PendingCN122400505AThe situation of large temperature difference along the equilibrium pathsame temperature
This invention discloses an isothermal forging process and equipment for ultra-high power-to-weight ratio UAV pistons, relating to the field of UAV piston forging technology. The process includes obtaining the target forging temperature, acquiring the temperature values ​​detected by temperature sensors on both sides of each set of flow channels in real time through a control system, acquiring the actual temperature of the die cavity before and after forging using a thermal infrared sensor, and predicting the predicted temperature within each part of the die cavity using the temperature values ​​detected by the temperature sensors on both sides of each set of flow channels and a preset die cavity temperature prediction model. This invention, through the cooperation between the isothermal forging die, cooling flow channels, and control system, while maintaining the total flow rate of the set at no less than the current total flow rate, superimposes a fixed pulse step value, forcing the temperatures at the inlet and outlet ends to approach each other, thus avoiding localized temperature differences and improving the forging quality of ultra-high power-to-weight ratio UAV pistons.
Owner:SHANDONG ZHENTING JINGGONG PISTON

Temperature adjusting device, semiconductor process equipment and temperature adjusting method

The invention discloses a temperature adjusting device, semiconductor process equipment and a temperature adjusting method, and belongs to the technical field of semiconductor processing. The temperature adjusting device is used for adjusting the temperature of the wafer, the temperature adjusting device comprises a shading assembly, a temperature detection assembly and a driving assembly, and the shading assembly is movably arranged between the heating source and the wafer and is used for shielding the wafer; the temperature detection element is used for detecting the temperature of the central area and the edge area of the wafer; the driving assembly is connected with the shading assembly and used for driving the shading assembly to act according to a detection signal of the temperature detection assembly so as to adjust the shading area of the shading assembly on at least one of the center area and the edge area. In the scheme, the shielding area of the shading assembly on at least one of the central area and the edge area is adjusted according to the temperature difference, detected by the temperature detection assembly, of the central area and the edge area of the wafer, it can be guaranteed that the temperatures of the central area and the edge area are the same, and therefore the wafer is prevented from deforming or jumping up from the supporting ring.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Oil-gas separation online measurement system and working method thereof

The invention relates to an oil-gas separation online measurement system and a working method thereof, the oil-gas separation online measurement system comprises an oil path unit, a degassing unit, a gas path unit and a measurement unit, and the working method specifically comprises the following steps: S1, bidirectionally cleaning an oil path; s2, blowing and washing a gas path in two directions; s3, quantifying the oil sample; s4, negative pressure extraction and negative pressure exhaust are carried out; s5, circulating the oil sample; s6, carrying out constant-pressure degassing; s7, compressing the gas; and S8, performing constant-temperature measurement. Through the step of arranging a two-way cleaning oil way and a two-way purging gas way before measurement, thorough cleaning of the oil way and the gas way before measurement is effectively guaranteed, in the oil sample extraction, oil-gas separation and gas sample measurement process, the pressure and temperature of oil and gas are kept constant, and the degassing efficiency and consistency are high. A gas path sensor is arranged in the gas path unit, and a constant temperature device is arranged in the measuring unit, so that the temperature and the pressure of gas in the measuring unit are ensured to be the same during each measurement, system errors caused by environmental factors are eliminated, and the accuracy of system measurement is further ensured.
Owner:WUHAN GELANRUO ELECTRICAL TECHNOLOGY CO LTD