Metallic packaging shell sintering method for controlling consistency of lead height

Abstract

The invention discloses a metallic packaging shell sintering method for controlling consistency of lead height, which comprises the following steps: arranging a bottom die of a graphite die on a die bracket or working platform; arranging a lead threading a glass insulator in a corresponding positioning hole on the bottom die; upwards arranging a mounting chip surface of a bottom board of a metallic packaging shell on the corresponding position on the bottom die; covering a cover board of the graphite die on a bottom board, wherein the cover board is provided with a counter bore with depth same with the height of the lead; leading the counter bore on the cover board to correspond to the positioning hole on the bottom board and to be buckled on the lead and the glass insulator; combining the cover board and the bottom die and then overturning; and placing in a nitrogen-protecting high-temperature furnace for sintering. The cooled graphite die is taken out of the high-temperature furnaceand then is overturned. The lead of the shell processed and sintered by the method does not need to be cut in length and planished and polished, therefore, the metallic packaging shell can achieve the design requirements of height requirement of the bonding face, air tightness of army metallic packaging shell, and the like.

Description

technical field [0001] The invention relates to a method for sintering a metal package shell, in particular to a method for controlling the height consistency of a lead wire and belongs to the field of packaging of electronic and optoelectronic products. Background technique [0002] In the manufacturing process of the metal package shell, the bottom plate and the lead wire of the metal package shell need to be sintered into one body with glass insulators in a nitrogen-protected high-temperature furnace. In this sintering process, the bottom plate of the shell, the glass insulator and the lead must be relatively fixed in the graphite mold and then placed in a high-temperature furnace for sintering. For the lead wire in-line shell, one method is to place the chip mounting surface of the shell and the bonding surface of the lead wire up in a graphite mold and then place it in a high-temperature furnace for sintering. At this time, the height of the wire bonding surface and th...

AI Technical Summary

Problems solved by technology

[0004] The above two sintering methods, the first one is likely to cause inconsistent height of the wire bonding surface and increase the difficulty of wire preparation

The second method requires additional equipment and processes, which increases the cost of the product

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