Packaging device for piezoelectric component

Abstract

The invention discloses a packaging device for a piezoelectric component. An upper cover and a lower cover correspondingly rotate to be clamped and fixed so as to form an accommodating space; a hole is formed in the middle of the upper cover and in the middle of the lower cover respectively; the inner edge of the upper cover and the inner edge of the lower cover are provided with a groove at the periphery of the hole respectively, and an annular elastomer is correspondingly embedded into the groove; the piezoelectric component is arranged in the accommodating space and between the elastomer of the upper cover and the elastomer of the lower cover; a conducting strip is arranged on the external surface of the upper cover and the external surface of the lower cover respectively; and a bent extending part of the conducting strip, such as a cylindrical conducting body passes through the hole in the middle of the upper cover, the hole in the middle of the lower cover, and the elastomers embedded into the grooves respectively, and is connected to nodes on the upper surface and lower surface of the piezoelectric component by welding, and reacting force which is applied to the grooves and the cylindrical conducting bodies by the elastomers is used to buffer upper, lower, left and right parts, so that a 360-degree anti-vibration effect is achieved.

Description

【Technical field】 [0001] The present invention relates to a piezoelectric component packaging device, in particular to a piezoelectric component packaging device that can prevent the piezoelectric component from being loosened and broken due to the vibration generated by the operation when the piezoelectric component is connected to the circuit. 【Background technique】 [0002] Press, the operation of the piezoelectric ceramic sheet (referred to as "piezoelectric sheet") is excited by the high-voltage pulse wave, and converts mechanical energy into electrical energy, which can be applied to power components, or can convert electrical energy into sound energy. It can be applied not only to the sound component (microphone) of the hands-free handset of the telephone, but also to ultrasonic technology and underwater image detection; also because the piezoelectric sheet will vibrate due to the effect of current conduction during operation, Therefore, there must be a very stable ci...

AI Technical Summary

Problems solved by technology

When the high-voltage pulse wave is input, the current is transmitted to the piezoelectric sheet through the conductive wire, which will cause the piezoelectric sheet to vibrate violently up, down, left, and right, and because the conductive wire is very thin, it is affected by the piezoelectric sheet. Intense vibration can easily damage or break the conductive wire, which will lead to poor operation or loss of function of the piezoelectric film

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