Transparent multi-layer circuit board

Abstract

The invention discloses a transparent multi-layer circuit board which comprises a multi-layer circuit board body and an insulating layer, wherein the multi-layer circuit board body is formed by overlaying a plurality of single-layer circuit boards; the insulating layer is uniformly arranged at each position on each single-layer circuit board; and the insulating layer is made of high-polymer transparent insulating ink. According to the transparent multi-layer circuit board, the high-polymer transparent insulating ink is adopted to replace the traditional epoxy resin prepreg, and technical personnel can observe the inside of the multi-layer circuit board and evaluate the drilling hole deviation. In the drilling manufacture procedure, hole deviation abnormality is reduced, parts of line problems can be detected from high-polymer insulating material, scraps are carried out in advance, the material waste of the subsequent manufacture procedure is reduced, and feed supplement processing is carried out in advance.

Description

technical field [0001] The invention relates to a multilayer circuit board, in particular to a transparent multilayer circuit board which is convenient for personnel to observe the inner layer, and belongs to the technical field of electronic components. Background technique [0002] During the production process of multilayer circuit boards, multiple circuits and laminations are required. Therefore, the inner circuit part will be laminated to the inside of the multilayer circuit board again. At present, the insulating material used in circuit boards is mainly epoxy The resin is mixed with some inorganic fillers, and its material properties do not have transparency. In the subsequent production process, the interior of the multilayer circuit board cannot be observed. For example, abnormal drilling deviation of the drilled holes, and abnormal opening and short circuit of the inner layer cannot be observed. It is found that technicians cannot make a judgment, and often flow ab...

AI Technical Summary

Problems solved by technology

[0002] During the production process of multilayer circuit boards, multiple circuits and laminations are required. Therefore, the inner circuit part will be laminated to the inside of the multilayer circuit board again. At present, the insulating material used in circuit boards is mainly epoxy The resin is mixed with some inorganic fillers, and its material properties do not have transparency. In the subsequent production process, the interior of the multilayer circuit board cannot be observed. For example, abnormal drilling deviation of the drilled holes, and abnormal opening and short circuit of the inner layer circuit cannot be observed. However, technicians cannot make a judgment, and often flow abnormal boards into the next process, and finally form defective products and cause excessive scrapping

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