Implement method for plane micro-strip linear high-distribution ratio unequal power divider

Abstract

The invention relates to an implement method for a plane micro-strip linear high-distribution ratio unequal power divider. Excessively high characteristic impedance is lowered by introducing the method of an improvement factor C, and a 'T'-shaped structure is used for replacing a quarter-wave transmission line with excessively low characteristic impedance, so that the line width of each microstrip line is in a reasonable range, and the difficulty in manufacturing the high-distribution ratio unequal power divider with a traditional plane microstrip line is solved. Moreover, compared with the prior art utilizing a double sided parallel strip line (DSPSL) or a non-ideal plane structure (DGS), the implement method has advantages in manufacturing cost and difficulty and circuit dimension.

Description

technical field [0001] The invention belongs to the field of microwave radio frequency circuits, and in particular relates to a method for realizing a planar microstrip line-type power divider with high distribution ratio and unequal ratio, which is applied to power distribution and power combining planar microstrip circuits requiring a high power distribution ratio. Background technique [0002] Power dividers are microwave passive devices used in power distribution and power combining circuits. The microstrip power divider is small in size and easy to integrate, so it is widely used in radio frequency microwave integrated circuits. In radio frequency circuits, there is often a demand for unbalanced distribution of radio frequency power, so the unequal microstrip power divider has important application value in practical radio frequency circuits. Due to its simple structure, the Wilkinson type power divider is more widely used. [0003] figure 1 It is the schematic diagr...

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Problems solved by technology

[0036] It can be seen from formula 9 that when the power distribution ratio K 2 ≥3, transmission line Z 2 The characteristic impedance of the microstrip line becomes very large. Due to the limitation of the processing technology, the characteristic impedance of the microstrip line can only be 120Ω~130Ω at the highest. If the characteristic impedance is too high, it will be difficult to achieve because the line width is too narrow.

[0037] In the case of high power distribution ratio, due to the limitation of the processing line width, it is difficult for the traditional microstrip Wilkinson power divider to achieve high characteristic impedance

In the existing technology, the use of double-sided parallel transmission line DSPSL (Double-Side Parallel-Strip line) can solve this problem, but the combination of DSPSL and microstrip line will introduce additional insertion loss and increase the circuit size; in addition, a A non-ideal ground plane structure using DGS (Defected Ground Structure) can enable a wider microstrip line width to achieve higher characteristic impedance, but it is much more difficult to manufacture than traditional microstrip lines

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