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292 results about "Microstrip circuits" patented technology

Double-frequency and double-polarization antenna capable of operating in compass satellite navigation system and mobile third-generation (3G) network

The invention discloses a double-frequency and double-polarization antenna capable of operating in a compass satellite navigation system and a mobile third-generation (3G) network and is implemented in a form of a laminated micro-strip circuit. The double-frequency and double-polarization antenna capable of operating in the compass satellite navigation system and the mobile 3G network comprises an upper-layer micro-strip antenna, a lower-layer micro-strip antenna and a metal floor layer, wherein the upper-layer micro-strip antenna has an upper-layer patch; the lower-layer micro-strip antenna has a lower-layer patch; the metal floor layer is arranged on a bottom layer; the upper-layer micro-strip antenna and the lower-layer micro-strip antenna share one metal floor layer; and the antenna is provided with six short-circuit metal columns which pass through the upper-layer micro-strip antenna and the lower-layer micro-strip antenna from the upper-layer patch and then are connected with the metal floor layer which is arranged on the bottom layer. The antenna adopts a feeding mode of dual-port coaxial feeding and has the advantages of simple and compact structure, miniaturization, convenience for processing and industrialized application, and the like.
Owner:SOUTH CHINA UNIV OF TECH

Low profile rear cavity ring gap one-point short circuit round polarization antenna

The invention relates to a one-point short-circuit circularly polarized antenna with a low-profile cavity-backed annular slot. The existing cavity-backed circularly polarized antenna based on one-point short-circuit of the annular slot has complex structure, large volume, inability to planar integration, and high cost. In the present invention, a metal layer is plated on both sides of the dielectric substrate, and the upper metal layer is etched with a microstrip line for power feeding and a common ground coplanar waveguide transmission line, and the middle metal strip of the coplanar waveguide transmission line extends outwards as a microstrip line . Through the upper metal layer, the dielectric substrate and the lower metal layer, a plurality of metallized through holes arranged in a circle are opened to form a cavity, and the coplanar waveguide transmission line extends into the cavity. The lower metal layer is etched with a circular radiation slit with a short circuit in the area corresponding to the cavity. Compared with the conventional cavity-backed circularly polarized antenna composed of a metal cavity, the present invention is manufactured by common PCB technology, has low manufacturing cost, can be seamlessly integrated with a microstrip circuit, and improves system integration.
Owner:HANGZHOU DIANZI UNIV

Microstrip waveguide double-probe transition structure

InactiveCN103474733ARealize in-phase superpositionInhibit outputWaveguidesDielectric substrateLength wave
The invention discloses a microstrip waveguide double-probe transition structure applicable to a millimeter-wave frequency multiplier. The structure includes an upper cavity, a lower cavity and a microstrip circuit. The lower cavity is covered with the upper cavity in a sealing way so that a rectangular waveguide cavity and a microstrip circuit shielding cavity are formed. The microstrip circuit is fixed in the microstrip-circuit shielding cavity. The microstrip circuit includes two microstrip probes, a power distribution/synthesis circuit and a dielectric substrate. The two microstrip probes and the power distribution / synthesis circuit are arranged on the same surface of the dielectric substrate. The two microstrip probes are connected with the two ends of the power distribution / synthesis circuit respectively. A distance between the center line of one microstrip probe and a rectangular-waveguide short-circuit face is 1/4 of a waveguide wavelength of an objective frequency and a distance between the center line of the other microstrip probe and the rectangular-waveguide short-circuit face is 5/4 of the waveguide wavelength of the objective frequency. The microstrip waveguide double-probe transition structure is capable of realizing same-phase superposition of an objective frequency signal and reversed-phase offset and output inhibition of a non-objective-frequency signal. The transition structure is simple in structure, convenient to manufacture and low in price.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Method for testing performance of semiconductor microwave power chip packaging shell

ActiveCN102621470AHigh precisionIntroducing Ceramic Dielectric Substrate Microstrip Circuit into Microwave Performance EvaluationSemiconductor/solid-state device testing/measurementIndividual semiconductor device testingTest performanceTest efficiency
The invention discloses a method for testing the performance of a semiconductor microwave power chip packaging shell, belonging to the field of methods for testing the performance of a semiconductor microwave power chip packaging shell. A ceramic dielectric substrate microstrip circuit, a PCB (Printed Circuit Board) microstrip line and a microwave test fixture are manufactured, a microwave test module, a DC offset module and the microwave test fixture cooperate with each other to perform microwave performance test on the PCB microstrip line, the ceramic dielectric substrate microstrip circuit and the target packaging shell and a combination thereof, and the test results are processed to obtain the microwave performance parameters of the target packaging shell. With the simple method, the microwave performance test of the packaging shell is realized, the manufacturing cost of the packaging shell is reduced, the test efficiency of the packaging shell is improved, precious data is accumulated for expressing the characteristics of the packaging shell, and a reliable guaranty is provided for improving the performance of a semiconductor microwave power device. In the test method provided by the invention, the use environment of the packaging shell is simulated, and the accuracy of the test results is increased.
Owner:THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP

Pattern electroplating method for microstrip circuit

The invention discloses a pattern electroplating method for a microstrip circuit, wherein the pattern electroplating method belongs to the technical field of a microwave millimeter wave film mixed integrated circuit. According to the pattern electroplating method, in the microstrip circuit with relatively large number of isolated conductor patterns, an original method of combining substrate front-surface pattern electroplating and back ground-surface integral electroplating is changed to a double-surface pattern electroplating process so that a medium layer at a cutting channel position is exposed to outside, thereby effectively preventing film layer falling in cutting the microstrip circuit, improving cutting quality and yield rate of the microstrip circuit, and settling a problem of film layer warpage and falling caused by stress influence to an electroplating functional layer of the microstrip circuit in a loading process and a discharging process of the electroplating protecting layer on the cutting channel in manufacture according to an existing process. According to the pattern electroplating method, electroplating deposition of the functional layer is only performed on the conductor pattern areas on the front surface and the back surface of an array circuit, thereby preventing plating of noble metals such as gold on other areas such as cutting channels and process edges outside the array pattern, reducing electroplating area and saving cost.
Owner:THE 41ST INST OF CHINA ELECTRONICS TECH GRP

GNSS (Global Navigation Satellite System) high-precision measuring antenna

The invention discloses a GNSS (Global Navigation Satellite System) high-precision measuring antenna, which comprises a reflecting cavity and a choke coil distributed on the periphery of the reflecting cavity; four centrosymmetrical feed oscillators are arranged in the reflecting cavity, and the necks of each two opposite feed oscillators are connected through a connecting plate; a microstrip feed cavity is arranged under the reflecting cavity, a microstrip circuit is arranged in the microstrip feed cavity, and the feed oscillators are electrically connected with the microstrip circuit in the microstrip feed cavity located under the reflecting cavity through internal conductors. Since the microstrip circuit is arranged in the microstrip feed cavity located under the reflecting cavity and the feed oscillators located in the reflecting cavity are electrically connected with the microstrip circuit located in the microstrip feed cavity through the internal conductors, electromagnetic interference is effectively reduced, and thereby the purity of feed signals is increased; moreover, since the GNSS high-precision measuring antenna adopts a broadband radiating unit composed of the four centrosymmetrical feed oscillators, a plurality of navigation satellite signals within a frequency band from 1.1GHz to 1.6GHz are fully covered, and thereby the operating frequency band of the receiving antenna is broadened.
Owner:HUNAN AEROSPACE HUNAYU COMM TECH CO LTD

Fast directional multilevel simulation method for planar microstrip circuit

The invention discloses a fast directional multilevel algorithm for analyzing a planar microstrip circuit. The planar microstrip circuit structure is analyzed based on the fast directional multilevel algorithm. In the algorithm, a complex circuit is divided by a planar triangular surface element, and the fast directional multilevel algorithm is combined with a Rao-Wilton-Glisson (RWG) function to be applied to an electric field integral equation to ensure the calculating accuracy of a model; and by utilizing a principle that an impedance matrix formed by a moment method when the field-to-source point distance is long enough has good low-rank characteristic, fast directional multilevel calculation is adopted for a far field area, a Green function is unfolded by a low-rank expression, the expansion is only related to calculation of a kernel function so as to greatly reduce the calculating complexity of the multilayer microstrip circuit, and the calculating complicity and internal memory demand are reduced to O(NlogN) magnitude. A quadtree form is also adopted for grouping analysis of the planar microstrip multilayer circuit, the consumption of the internal memory is effectively reduced, the calculation result is accurate, the testing cost is low, and the fast directional multilevel algorithm can be widely applied to simulation analysis of complex circuits.
Owner:NANJING UNIV OF SCI & TECH

Waveguide-microstrip linear transformation and power divider based on slot coupling

The invention discloses a wave guide and microstrip line convertor and power divider of a vertical structure based on slit coupling. The power divider comprises the following parts which are successively arranged from bottom to up: a waveguide tube, a first metal earth plate with an opening having the same shape as the waveguide tube, a first dielectric slab, a second metal earth plate with an opening having the same shape as the waveguide tube, a third metal earth plate and a second dielectric slab. A surface facing to the waveguide tube of the first dielectric slab is attached with a frequency regulating unit; two microstrip lines are arranged above the second dielectric slab in parallel, and two rectangular slits used for electromagnetic energy coupling are etched on the third metal earth plate; the peripheries of the first dielectric slab, the first metal earth plate and the second metal earth plate are provided with metal through holes which are evenly distributed along a side line of the waveguide tube mouth. The power divider has simple structure and little volume and can be conveniently integrated in the structures needing wave guide for feeding, such as a microstrip circuit system; in addition, the invention adopts a vertical structure, which allows the design to be more flexible and more convenient.
Owner:HUIZHOU SPEED WIRELESS TECH CO LTD

Rectangle substrate integrated waveguide back cavity linear polarization antenna

The invention relates to a polarized antenna with wave guiding cavity-backed lines integrated on a rectangular substrate. The traditional polarized antenna has the disadvantages of low performance of single radiation unit, large bulk, complex structure and high manufacturing cost. The dielectric substrate of the invention is plated with metallic layers on two sides; the upper metallic layer is etched with a microstrip line for feeding and a plurality of coplanar wave guiding transmission lines; the coplanar wave guiding transmission lines are grounded coplanar wave guiding structure, wherein, the metallic strip in the middle is extended outwards to form the microstrip line. A plurality of metallized through holes, which are arrayed as a square, are penetrated through the upper metallic layer, the medium substrate and the lower metallic layer to form the cavity; the coplanar wave guiding transmission lines are extended into the cavity. An elongated radiation slit is etched on the lower metallic layer corresponding to the cavity. The invention has the advantages that: by adopting the general PCB technology, the production cost is notablely decreased and the invention can be integrated with the microstrip circuit without seam, the integrity of the system is improved; compared with the exact machining of the traditional cavity-backed antennas, the manufacture speed is high and the cost is low.
Owner:舟山亿佳电子科技有限公司

Unijunction microstrip circulator or microstrip isolator with magnetic shielding case

InactiveCN103647125AGood magnetic shielding functionSimple structureWaveguide type devicesDielectric substrateMicrostrip circuits
The invention relates to a unijunction microstrip circulator or microstrip isolator with a magnetic shielding case and belongs to the technical field of magnetic materials and devices. The unijunction microstrip circulator or microstrip isolator with the magnetic shielding case comprises a soft magnetic alloy bottom plate and a ferrite substrate positioned on the soft magnetic alloy bottom plate, wherein the upper surface of the ferrite substrate is provided with a junction circulation microstrip circuit, and the lower surface of the ferrite substrate is provided with a grounding metal layer. The geometric center of the junction circulation microstrip circuit is provided with a permanent magnet which is provided with the magnetic shielding case, a first dielectric substrate is arranged between the permanent magnet and the junction circulation microstrip circuit, and a second dielectric substrate is arranged between the permanent magnet and the magnetic shielding case. The magnetic shielding case is formed by bending the edge of a soft magnetic flat plate material downwards, the smallest horizontal enclosure dimension is larger than the diameter of the permanent magnet and smaller than the side length of the ferrite substrate, and the bottom of the edge of the magnetic shielding case does not contact with the ferrite substrate. The unijunction microstrip circulator or microstrip isolator with the magnetic shielding case has a good magnetic shielding function, and is simple in structure, stable in performance, convenient to produce and debug and capable of meeting application needs of increasing miniaturization and high integration.
Owner:CHENGDU ZHILI MICRO TECH

Hard microstrip circuit electroplating fixture

The invention relates to a hard microstrip circuit electroplating fixture, which comprises a main body and conductive magnetic clamping fingers. The main body comprises hard microstrip circuit substrate frames, electrodes I, electrodes II and magnets I. Each conductive magnetic clamping finger comprises electrodes III and a magnet II. The magnets I on the main body and the magnets II on the conductive magnetic clamping fingers attract each other to enable the conductive magnetic clamping fingers to fix hard microstrip circuit substrates in the hard microstrip circuit substrate frames on the main body. The electrodes I on the main body are electrically connected with back surfaces or front surfaces of hard microstrip circuits. The electrodes II on the main body are electrically connected with the front surfaces or the back surfaces of the hard microstrip circuits through the electrodes III on the conductive magnetic clamping fingers. All electrodes I on the main body are electrically connected with a lead-out electrode I. All electrodes II on the main body are electrically connected with a lead-out electrode II. Compared with the existing electroplating fixture, the hard microstrip circuit electroplating fixture provided by the invention has the advantages that very thin electroplated parts can be prevented from being damaged; the consistency of electric contact is good; the loading and unloading efficiency of the electroplated parts is high; and the precious metal is saved.
Owner:CHINA ELECTRONIS TECH INSTR CO LTD

Low-pass band-pass five-duplex based on novel frequency separation structure

The invention discloses a low-pass band-pass five-duplex based on a novel frequency separation structure, which achieves through a microstrip circuit, and comprises a low-pass wave filter (T1) and four different center frequencies of band-pass wave filters (T2,T3,T4 and T5). The low-pass band-pass five-duplex based on the novel frequency separation structure can adjust a transmission zero on a band-pass side of the low-pass wave filter in a certain range by leading in a stepped impedance side line, thereby improving selectivity. The low-pass band-pass five-duplex based on the novel frequency separation structure can generate attenuation poles outside a low-pass wave filter band pass by leading in a defected ground structure, and greatly enlarges a stopband suppression range of a wave filter. The low-pass band-pass five-duplex based on the novel frequency separation structure can conveniently increase the channel number of multiple duplexes by using the novel frequency separation structure, and can control the center frequency of the band-pass channels. The low-pass band-pass five-duplex based on the novel frequency separation structure greatly reduces the effect of mutual interference between various channels by being excellently matched with the network, and enables various ports to have excellent isolation. The low-pass band-pass five-duplex based on the novel frequency separation structure has the advantages that the low-pass band-pass five-duplex based on the novel frequency separation structure is excellent in frequency selectivity, high out-of-band rejection, high isolation, small volume and simple and reliable structure and the like.
Owner:SOUTH CHINA UNIV OF TECH

Single feedback low profile back cavity dual-frequency bilinear polarization antenna

The invention relates to a single-fed, low-contour, cavity-backed, and double-frequency bilinear polarized antenna. The single radiation unit on the traditional double-frequency antennas is poor in performance; and the prior double-frequency and cavity-backed antenna has the disadvantages of large bulk, complex structure and high manufacturing cost. The invention is characterized in that the substrate is plated with metallic layers on two sides, wherein, the upper metallic layer is etched with a microstrip line for feeding and a plurality of grounded coplanar wave guiding transmission lines, wherein, the metallic strip in the middle is extended outwards to form the microstrip line. A plurality of metallized through holes, which are arrayed as a square, are penetrated through the upper metallic layer, the medium substrate and the lower metallic layer to form the cavity; the coplanar wave guiding transmission lines are extended into the cavity. Two orthogonal elongated radiation slits are etched on the lower metallic layer corresponding with the cavity. The invention has the advantages that: by adopting the general PCB technology, the production cost is notablely decreased and the invention can be integrated with the microstrip circuit without seam, the integrity of the system is improved; compared with the exact machining of the prior bilinear cavity-backed antennas, the manufacture speed is high and the cost is low.
Owner:舟山亿佳电子科技有限公司
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