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Fast directional multilevel simulation method for planar microstrip circuit

A microstrip circuit and directional technology, applied in electrical digital data processing, instruments, calculations, etc., to achieve the effects of reducing matrix filling time, ensuring calculation accuracy, and low experimental testing costs

Inactive Publication Date: 2011-05-11
NANJING UNIV OF SCI & TECH
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Problems solved by technology

But so far there is no report on the solution of multilayer planar microstrip circuits using this algorithm

Method used

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  • Fast directional multilevel simulation method for planar microstrip circuit
  • Fast directional multilevel simulation method for planar microstrip circuit
  • Fast directional multilevel simulation method for planar microstrip circuit

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Embodiment Construction

[0020] Combined with the accompanying drawings below, with figure 1 The quasi-periodic electromagnetic bandgap (EBG) structure with seven periods shown is taken as an example, and the specific steps of the present invention are further described in detail.

[0021] Simulation according to the invention figure 1 The fast multi-layer directivity algorithm for the shown electromagnetic bandgap (EBG) structure, its specific operation steps are as follows:

[0022] The first step, according to figure 1 The geometric dimensions of the electromagnetic bandgap (EBG) structure shown are modeled using Ansys software, and the electromagnetic bandgap (EBG) structure is subdivided separately using a triangular mesh based on the Rao-Wilton-Glisson (RWG) basis function , according to the principle that the number of triangles subdivided per square electric wavelength is greater than 120, that is, the number of unknown quantities of the electromagnetic bandgap (EBG) structure and the coordi...

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Abstract

The invention discloses a fast directional multilevel algorithm for analyzing a planar microstrip circuit. The planar microstrip circuit structure is analyzed based on the fast directional multilevel algorithm. In the algorithm, a complex circuit is divided by a planar triangular surface element, and the fast directional multilevel algorithm is combined with a Rao-Wilton-Glisson (RWG) function to be applied to an electric field integral equation to ensure the calculating accuracy of a model; and by utilizing a principle that an impedance matrix formed by a moment method when the field-to-source point distance is long enough has good low-rank characteristic, fast directional multilevel calculation is adopted for a far field area, a Green function is unfolded by a low-rank expression, the expansion is only related to calculation of a kernel function so as to greatly reduce the calculating complexity of the multilayer microstrip circuit, and the calculating complicity and internal memory demand are reduced to O(NlogN) magnitude. A quadtree form is also adopted for grouping analysis of the planar microstrip multilayer circuit, the consumption of the internal memory is effectively reduced, the calculation result is accurate, the testing cost is low, and the fast directional multilevel algorithm can be widely applied to simulation analysis of complex circuits.

Description

technical field [0001] The invention relates to an electromagnetic characteristic simulation technology based on a microstrip circuit, in particular to a fast multi-layer directional simulation method of a planar microstrip circuit. Background technique [0002] Microstrip circuits, like microstrip antennas, are widely used in microwave relay communication, mobile communication, radar, navigation, rocket guidance and other fields due to their advantages of small size, light weight, low cost, high performance and reliability, etc. Broadband, miniaturization, and complex structures are developing, and new developments also put forward higher requirements for the design of microstrip circuits. At present, using software simulation to analyze such problems has become an important means of pre-production design. How to efficiently perform fast full-wave electromagnetic analysis and parameter extraction on it is very important. At present, the method of simulation and analysis of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 丁大志陈如山樊振宏陈华沙侃叶晓东
Owner NANJING UNIV OF SCI & TECH
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