Method for testing performance of semiconductor microwave power chip packaging shell

Abstract

The invention discloses a method for testing the performance of a semiconductor microwave power chip packaging shell, belonging to the field of methods for testing the performance of a semiconductor microwave power chip packaging shell. A ceramic dielectric substrate microstrip circuit, a PCB (Printed Circuit Board) microstrip line and a microwave test fixture are manufactured, a microwave test module, a DC offset module and the microwave test fixture cooperate with each other to perform microwave performance test on the PCB microstrip line, the ceramic dielectric substrate microstrip circuit and the target packaging shell and a combination thereof, and the test results are processed to obtain the microwave performance parameters of the target packaging shell. With the simple method, the microwave performance test of the packaging shell is realized, the manufacturing cost of the packaging shell is reduced, the test efficiency of the packaging shell is improved, precious data is accumulated for expressing the characteristics of the packaging shell, and a reliable guaranty is provided for improving the performance of a semiconductor microwave power device. In the test method provided by the invention, the use environment of the packaging shell is simulated, and the accuracy of the test results is increased.

Description

technical field [0001] The invention relates to a method for testing the performance of a semiconductor chip packaging shell, in particular to a performance testing method for a semiconductor microwave power chip packaging shell. Background technique [0002] Semiconductor materials such as GaAs, GaN, and SiC have been widely used in the manufacture of semiconductor microwave power devices because of their excellent characteristics such as band gap, high thermal conductivity, and high carrier saturation drift velocity. Semi-compound conductor materials such as GaAs, GaN, and SiC can be used to make microwave power chips, and microwave power chips are called devices after being packaged in a package. The microwave performance of the device mainly includes three items: power, gain and efficiency. [0003] The packaging shell is composed of a base, a ceramic part, a cap ring, an input terminal and an output terminal. The role of the base is to provide mechanical support and h...

AI Technical Summary

Problems solved by technology

The simulation method cannot truly reflect the performance of the tube and shell

It is impossible to evaluate the real microwave parameters of the shell by using the method of microwave performance testing of the module made of the chip and the package shell. It can only evaluate the microwave performance of the chip and the package shell combined into one module, and this method requires the use of expensive chips and costs Too high, especially when a large number of packages are inspected in batches

Images