Detector for detecting liquid crystal module

Abstract

The invention discloses a detector for detecting a liquid crystal module. The detector comprises top plates and an overturn assembly, wherein the top plates comprise the first top plate and the second top plate, the first top plate is used for carrying the module to be detected, and the overturn assembly is arranged on the second top plate in a turnover mode; the overturn assembly comprises at least one substrate fixing plate, wherein at least one detection substrate is arranged on the substrate fixing plate, and the detection substrate is provided with at least one connector detection port used for detecting a connector of the module to be detected. According to the detector for detecting the liquid crystal module, the module to be detected is convenient to replace in the operation process, the fault rate of the connector detection ports on the module to be detected is reduced, the service life of the connector detection ports on the detection substrates is prolonged, production efficiency is effectively improved, and production cost is reduced.

Description

technical field [0001] The invention relates to a detection device, in particular to a detection device for liquid crystal module detection. Background technique [0002] Existing liquid crystal module testing fixtures are processed and assembled from black bakelite, sheet metal parts, fixtures, PCB boards, electronic components and various signal lines. It adopts a complete contact method in the detection process, that is, the connector port on the module to be tested is completely pressed into the connector detection port on the contact detection substrate. For products with multiple connector ports, the conduction detection method is also used to detect the crimping of the ports one by one. The existing method mainly has the following two disadvantages: 1. The detection speed is slow and the production efficiency is low; 2. The connector port on the module to be tested and the connector detection port on the detection substrate are easily damaged, which increases the pro...

AI Technical Summary

Problems solved by technology

The existing method mainly has the following two disadvantages: 1. The detection speed is slow and the production efficiency is low; 2. The connector port on the module to be tested and the connector detection port on the detection substrate are easily damaged, which increases the product defect rate , leading to an increase in production costs

When testing, the connector on the product side is directly buckled on the connector on the contact substrate, and it needs to be completely pressed in, because the connector is relatively small, and the alignment crimping is very difficult to align, and it is easy to crush the connector. When it is opened, the connector The male end and the female end are locked with hooks, which requires force to open. It is easy to disengage the FPC pad PIN pin welded on the product, and in severe cases, the entire connector will fall off. The result of this is The production speed is slow, the product defect rate is high, and the contact substrate is damaged quickly (the life of each connector is limited to 20-50 times when fully connected), and the manufacturing cost is high

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