The application discloses an embedded
power module test fixture and a manufacturing method thereof, relates to the technical field of
semiconductor power module testing, and aims to solve the problem of large parasitic parameters of a
test fixture and limited testing precision in the prior art. The
test fixture comprises a
probe card, spring needles, connecting lines and a crimping box. The
probe card is a PCB circuit board on which a test
circuit diagram is printed, and a needle sleeve, a threaded hole and a cable interface are reserved on the
probe card. The spring needles are installed in place through the needle sleeve. One end of the connecting line is connected with the cable interface of the probe card, and the other end of the connecting line is connected with a testing
machine. A reinforcing structural member is fixed to the back of the probe card through connecting screws. The crimping box is used for accommodating and fixing the probe card, and makes the
welding pads of a measured module contact the spring needles through a crimping action to form a test loop. The application replaces the traditional manual wire
welding connection with a PCB printed circuit, greatly reduces the parasitic
inductance and resistance of the test loop, and improves the
signal reliability.