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Heat transfer type server chassis

A server and chassis technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve server heat dissipation and other problems, achieve the effects of small size, save space in the chassis, and increase service life

Inactive Publication Date: 2014-06-04
BEIJING FULLLINK OREITH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the heat dissipation problem of existing servers, and provide a contact heat transfer type server case in which the heat transfer type server case is in close contact with the server. Radiated heat is transferred directly to the environment through the metal server enclosure

Method used

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  • Heat transfer type server chassis
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Embodiment Construction

[0016] Specific embodiments of the present invention are described with reference to the above drawings.

[0017] Such as figure 1 The sectional view of the server case of the present invention includes a case base (1), a case upper cover (2) and a server (3); the bottom plate of the case base (1) and the four side plates of the bottom plate are Cast one-piece structure; the casing base (1) is a metal shell with good thermal conductivity, and the inside of the bottom plate of the casing base (1) is based on the electronic components ( 4) The structural shape is cast with a groove type or a convex structure, so that the bottom plate of the chassis base (1) can be in close contact with the electronic components (4) that generate a large amount of heat on the server (3); There is a space between the bottom plate of the casing base (1) and the electronic components with low heat generation on the server (3), and they are not in contact; the outer surface of the bottom plate of th...

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Abstract

The invention discloses a heat transfer type server chassis which comprises a chassis base and a chassis upper cover. A base plate of the chassis base and four side plates of the base plate are cast to form an integral structure, the chassis base is a metal chassis with good heat conductivity, and a groove-shaped or convex structure is cast inside the base plate of the chassis base according to the shape of an electronic component with large heat productivity on a server, so that the base plate of the chassis base and the electronic component with large heat productivity on the server can be in tight contact. By adopting the groove-shaped structure inside the server cast-aluminum chassis, the heat transfer type server is not provided with a fan for heat transfer in the inside, the electronic component with large heat productivity can be in tight contact with the groove-shaped or convex structure cast inside the base plate of the chassis base, and dissipated heat is directly conducted out through the metal chassis with good heat conductivity.

Description

technical field [0001] The invention relates to a server casing, in particular to a server casing capable of realizing contact heat transfer. Background technique [0002] The heat dissipation of the server is always the focus of the industry. Today, with the increasing computing density and increasing power consumption, the heat dissipation problem of servers, especially data centers with a large number of application servers, will always be "lingering". Now, Because external heat dissipation is difficult to completely solve the problem, and the heat dissipation efficiency is low, it often causes local overheating inside the server, thus failing to meet the heat dissipation requirements of the server. Therefore, more and more server manufacturers have focused the heat dissipation of the server on the inside of the server. For server heat dissipation, especially internal heat dissipation, simply increasing the number of fans or increasing the fan speed cannot solve the probl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
Inventor 祝长宇丁式平何慧丽
Owner BEIJING FULLLINK OREITH TECH CO LTD
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