Liquid cooling heat dissipation cold plate

Abstract

The invention relates to a water cooling heat dissipation cold plate. The cooling heat dissipation cold plate is characterized by comprising a base plate, a cooling part and a cover plate; the base plate comprises a cooling plate face and a bottom face opposite to the cooling plate face; the cooling part is arranged above the cooling plate face and comprises a first passage area, a second passage area, a third passage area, a water inlet and a water outlet; the cover plate is arranged above the cooling part. The first passage area, the second passage area and the third passage area are sequentially arranged on the cooling plate face in parallel, the second passage area is located between the first passage area and the third passage area, the first passage area, the second passage area and the third passage area are communicated with the water inlet and the water outlet, cooling water enters the first passage area, the second passage area and the third passage area from the water inlet in three routes and flows out from the water outlet. By means of the water cooling heat dissipation cold plate, heat dissipated by an electronic device can be sufficiently taken away; the water cooling heat dissipation cold plate is convenient to use.

Description

technical field [0001] The invention relates to a liquid-cooled and heat-dissipating cold plate, which belongs to the field of electronic equipment. Background technique [0002] At present, electronic equipment tends to be more and more compact and modularized, and the power and packaging technology used are also tending to be more and more high-power and high-density packaging, which makes the heat loss power of electronic equipment in use Rapidly increasing, the surface heat flux of some electronic equipment has reached tens of watts or even hundreds of watts per square centimeter. Therefore, how to effectively and quickly cool down the electronic equipment plays an important role in maintaining the service life and working efficiency of the electronic equipment. [0003] The cooling methods of electronic equipment are mainly active cooling and passive cooling. Among them, the cooling capacity of active cooling is stronger. [0004] Active cooling usually requires forc...

AI Technical Summary

Problems solved by technology

The common forced air cooling heat dissipation is mainly a fin radiator and a fan, but when encountering high-density packaging and high-power electronic components, its heat dissipation capacity cannot meet the requirements

In order to meet the increasing heat dissipation requirements, forced water cooling has been widely used, but the high heat dissipation capacity will increase the volume, and if the heat dissipation device is not well sealed, it is likely that the refrigerant will come into direct contact with the electronic equipment. cause damage to the equipment

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