A liquid-cooled heat dissipation cold plate

Abstract

A water-cooled heat dissipation cold plate is characterized in that it has: a bottom plate including a cooling plate surface and a bottom surface opposite to the cooling plate surface; a cooling part arranged on the cooling plate surface includes a first flow channel area, a second flow channel area, The third runner area, the water inlet, and the water outlet; and a cover plate arranged above the cooling part. The first flow channel area, the second flow channel area, and the third flow channel area are sequentially arranged in parallel on the cooling plate surface, the second flow channel area is located between the first flow channel area and the third flow channel area, the first flow channel area, the third flow channel area The second runner area and the third runner area are connected with the water inlet and the water outlet, and the cooling water enters the first runner area, the second runner area, and the third runner area respectively through the water inlet, and then out through the outlet. The water-cooling and heat-dissipating cold plate involved in the invention can fully take away the heat dissipated by electronic equipment, and is convenient to use.

Description

technical field [0001] The invention relates to a liquid-cooled and heat-dissipating cold plate, which belongs to the field of electronic equipment. Background technique [0002] At present, electronic equipment tends to be more and more compact and modularized, and the power and packaging technology used are also tending to be more and more high-power and high-density packaging, which makes the heat loss power of electronic equipment in use Rapidly increasing, the surface heat flux of some electronic equipment has reached tens of watts or even hundreds of watts per square centimeter. Therefore, how to effectively and quickly cool down the electronic equipment plays an important role in maintaining the service life and work efficiency of the electronic equipment. [0003] The cooling methods of electronic equipment are mainly active cooling and passive cooling. Among them, the cooling capacity of active cooling is stronger. [0004] Active cooling usually requires forced ...

AI Technical Summary

Problems solved by technology

The common forced air cooling heat dissipation is mainly a fin radiator and a fan, but when encountering high-density packaging and high-power electronic components, its heat dissipation capacity cannot meet the requirements

In order to meet the increasing heat dissipation requirements, forced water cooling has been widely used, but the high heat dissipation capacity will increase the volume, and if the heat dissipation device is not well sealed, it is likely that the refrigerant will come into direct contact with the electronic equipment. cause damage to the equipment

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